“…Also, deposition rates for CVD and thermally-driven processes, such as SiO 2 growth from silicon, could be significantly altered (less so for PVD) by applying heat to certain regions while a reactive gas load is applied to the system, thus selectively enhancing the rate of reaction. Researchers at the University of California at Berkeley have recently published results from a related technique in which resistive heat generated through directly applied currents is used to locally enhance the growth rate of PECVD polysilicon [Joachim, et al, 2003] often require a magnetic anneal, a low-temperature anneal in the presence of a constant magnetic field, in order to establish the uniaxial anisotropy required for digital data storage capability [Jun, et al, 2004]. CMOS-compatible temperature elevation could be achieved through inductive heating, either using a time-varying field separate from the constant poling field or a single field with both direct and alternating components, or through other localized means [Bergstrom, et al, 2007]…”