Roughness damage evolution due to wire saw process

Teomete, Egemen

doi:10.1007/s12541-011-0126-4

Cited by 30 publications

(17 citation statements)

References 28 publications

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“…This comparison shows that the process productivity can be increased without increasing damage on sliced wafer surface by increasing feed rate proportionally with respect to wire speed. This result is similar to other works based on the experimental results [12,14].…”

Section: Simulation Resultssupporting

confidence: 93%

“…Researchers have focused on different aspects of the wire sawing process which can be classified into material removal mechanism [5][6][7], process modeling [8][9][10][11], and parametric study between process inputs and outputs [12][13][14][15][16]. In order to fulfill the strict requirements in wafer surface quality, some studies concentrate the ways to minimize surface defects by controlling wire and process parameters [5,13,14].…”

Section: Introductionmentioning

confidence: 99%

“…In order to fulfill the strict requirements in wafer surface quality, some studies concentrate the ways to minimize surface defects by controlling wire and process parameters [5,13,14]. Some suggestions have been made for improving surface quality [6,12,13].…”

Section: Introductionmentioning

confidence: 99%

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Depth of cut per abrasive in fixed diamond wire sawing

Chung

2015

Int J Adv Manuf Technol

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Because of the high requirement for quality, the surfaces of prime wafers have to be flat and without damages. During the first machining process in wafer manufacturing, the defects introduced by wire sawing must be removed by the subsequent lapping, grinding, and polishing processes. Therefore, the quality of sliced wafer is very important. Fixed diamond wire saw, on which the diamond grains are coated as abrasives, has become the major tool to slice ingot into wafers. Ductile-regime machining is an attractive process to achieve crack free surface on brittle materials in abrasive machining process. The depth of cut of the abrasive is a hint for the transition between ductileand brittle-regime machining. In order to understand the cutting behavior in fixed diamond wire sawing, this paper presents an investigation of depth of cut per abrasive based on the wire profile model developed by the authors. The simulation results show that the larger depths of cut are unavoidable in fixed diamond wire sawing because of the random position and size distribution of diamond grains on the wire. Although the number of active abrasives and the depths of cut at the bottom of slicing groove are larger than those at the side of the groove, few larger diamond Van-Nhat Le grains may introduce larger depths of cut and cracks on the side, which is the sliced wafer surface. Effects of process parameters to the depth of cut distributions are also analyzed. The variation in number of active abrasives in cutting zone as well as their depth of cut shows the possibility to increase process productivity without increasing the depths of cut of the diamond grains. Consequently, the surface quality could be remained without further deterioration.

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Section: Simulation Resultssupporting

confidence: 93%

Section: Introductionmentioning

confidence: 99%

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Depth of cut per abrasive in fixed diamond wire sawing

Chung

2015

Int J Adv Manuf Technol

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“…The greatest advantages of using diamond wire in multi-wire sawing are the low kerf loss, minimal surface damage, and high productivity. 3 A recent study on diamond wire was conducted to analyze the effect of varying the manufacturing method on the cutting characteristics of the obtained wire. 4,5 However, the study did not sufficiently analyze the actual states caused by mass production and identify the solutions.…”

Section: Introductionmentioning

confidence: 99%

Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw

Kim

Lee

et al. 2015

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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Sapphire wafers are widely used as substrates for fabricating gallium nitride light-emitting diodes. The quality of light-emitting diodes depends on the total thickness variation and BOW of the wafers. The multi-wire saw process is critical in determining post-processing times for steps such as diamond mechanical polishing and chemical mechanical polishing. In particular, thickness variation is affected by wear of diamond wires, which in turn is controlled by cutting conditions including wire speed, feed rate, initial contact condition between ingot and wire, and new wire consumption. Thickness variation shows a marked change from the initial to final feeding location during the multi-wire sawing process. A wire is not worn when it is initially contacted by an ingot. Hence, the initial kerf loss is greater than the kerf loss at the final feeding location. This study focused on minimizing the thickness variation between the initial and final contact points of the wafer. Experiments were conducted with different initial wire deflection conditions. The experimental results showed that increasing the wire deflection increased the cutting load, which in turn caused severe wear of the wire. Consequently, the thickness variation of the wafer in the multi-wire sawing process was controlled by adjusting the wire deflection.

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“…Worldwide research on cutting mechanisms and abrasive movement states of multiwire sawing is based on assumptions and experimental verification [15][16][17]; the motion state cannot be revealed directly during the process, and, thereby, the cutting mechanisms are essentially studied by means of microscopic observations of the moving abrasive state in semifixed abrasive wire-saw slicing. In this paper, all the experiments are observed using high-speed camera equipment, and the dynamic images of the moving-grits state in the cutting process are obtained and the motion properties analyzed by computers.…”

Section: Introductionmentioning

confidence: 99%

Mechanism and Motion of Semifixed Abrasive Grit for Wire-Saw Slicing

Yao

Peng

Chen

2013

Advances in Mechanical Engineering

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The currently dominant method in the production of wafers is to use slurry wire-saw slicing. This paper reports a new wire-saw slicing technology, namely, semifixed abrasive wire-saw slicing. The traditional smooth wire is replaced by a patterned wire with a textured surface that can help the wire carrying the abrasives. It aims to improve the number of transient fixed abrasives in the machining process. Transient fixed abrasives can produce "scratch-indenting" processes that are similar to fixed-abrasive wire slicing thereby improving the efficiency of the wire-saw cutting. This study focuses on the behavioral mechanics of the abrasive grits in the slurry during the slicing process. The dynamic images of the movement of abrasive grits in the slicing process are obtained by a high-speed camera. At the microlevel, using statistical methods, the behavioral mechanics of the abrasive grits are investigated by changing the slicing parameters. The results contribute toward a more intuitive and profound understanding of the principle of free-abrasive wire sawing.

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Roughness damage evolution due to wire saw process

Cited by 30 publications

References 28 publications

Depth of cut per abrasive in fixed diamond wire sawing

Depth of cut per abrasive in fixed diamond wire sawing

Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw

Mechanism and Motion of Semifixed Abrasive Grit for Wire-Saw Slicing

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