Roundness and cylindricity

Smith, Graham T.

doi:10.1007/978-1-4471-3814-3_4

Cited by 18 publications

(23 citation statements)

References 31 publications

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“…Measurement results showed an improvement in the evaluation of rough surfaces (Figure 8 -cone seat with a 3 lobed manufacturing error [10]), specially in spots with two strong speckles ( Figure 9). However, for the evaluation of an interferogram without additional speckle the measured value's standard deviation shows an increase in relation to the method using the envelope's max.…”

Section: Spatial Domain Analysis Of the Speckle Effectmentioning

confidence: 99%

Evaluation of the usage of a fiber optic low-coherence interferometer for surface profile measurements using speckles analysis

Schmitt

Mallmann

2010

SPIE Proceedings

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The low-coherence interferometry is already an established technique for the high-resolution characterization of surface profiles. Its application in many industrial areas is however partially limited due to undesired effects in the interference pattern caused by different surface's roughness and form properties. The appearance of speckles in rough surfaces or the batwing-effect in high-precision topographies are examples of undesired influences. Another important limiting factor is the size and robustness of the metrological set-ups. The measurement of small cavities or the integration in production machines are therefore still a challenge. In this work the application of a fiber-optical low-coherence interferometer for the characterization of different surface profiles, as well as miniaturized and / or hard accessible features is presented. Focus will be given on the measurement of optical "uncooperative" surfaces, as rough and / or curved surfaces, for example in small cavities, using the analysis of the speckle phenomena.

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Section: Spatial Domain Analysis Of the Speckle Effectmentioning

confidence: 99%

Evaluation of the usage of a fiber optic low-coherence interferometer for surface profile measurements using speckles analysis

Schmitt

Mallmann

2010

SPIE Proceedings

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“…This technique is known to provide the highest resolution for the measurements in the third dimension. 2 Despite the benefits of AFM as one of the key metrology tools in semiconductor industry, it has been known for the laborious efforts needed to locate the defects found by inspection tools. Therefore manual defect review by AFM has been suffering from its low throughput.…”

Section: Motivationmentioning

confidence: 99%

High-throughput automatic defect review for 300mm blank wafers with atomic force microscope

et al. 2015

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While feature size in lithography process continuously becomes smaller, defect sizes on blank wafers become more comparable to device sizes. Defects with nm-scale characteristic size could be misclassified by automated optical inspection (AOI) and require post-processing for proper classification. Atomic force microscope (AFM) is known to provide high lateral and the highest vertical resolution by mechanical probing among all techniques. However, its low throughput and tip life in addition to the laborious efforts for finding the defects have been the major limitations of this technique. In this paper we introduce automatic defect review (ADR) AFM as a post-inspection metrology tool for defect study and classification for 300 mm blank wafers and to overcome the limitations stated above. The ADR AFM provides high throughput, high resolution, and non-destructive means for obtaining 3D information for nm-scale defect review and classification.

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“…Therefore, residual stresses are an important consideration when both designing components and planning their manufacturing process routes. This is important as each operation a component undergoes either adds to or removes the residual stress patterns that were induced by any previous operation [5,6].…”

Section: Introductionmentioning

confidence: 99%