2001
DOI: 10.1109/43.920700
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Routability-driven repeater block planning for interconnect-centric floorplanning

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Cited by 49 publications
(87 citation statements)
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“…Therefore, there is only 34 nets violate the constraints because of the failure of buffer insertion. While the best result in [3] is that 368 nets meet their [3] because that those methods are based on fix-die placement, while the floorplanning should be optimized to meet the given timing constraints in our algorithm. Even though, we can see some improvement in the results because our algorithm can give a more feasible floorplan structure for buffer insertion.…”
Section: Methodsmentioning
confidence: 99%
See 2 more Smart Citations
“…Therefore, there is only 34 nets violate the constraints because of the failure of buffer insertion. While the best result in [3] is that 368 nets meet their [3] because that those methods are based on fix-die placement, while the floorplanning should be optimized to meet the given timing constraints in our algorithm. Even though, we can see some improvement in the results because our algorithm can give a more feasible floorplan structure for buffer insertion.…”
Section: Methodsmentioning
confidence: 99%
“…The feasible region for a buffer 'b' is the maximum region where 'b' can be located such that by inserting buffer 'b' into any location in that region, the delay constraint can be satisfied. Sarkar et al [3] gives the notion of independent feasible regions(IFR) and the IFRs of buffers belonging to the same net do not overlap each other. Here we use the concept of IFR so that the feasible regions of different buffers on a net can be computed independently.…”
Section: Computation Of Possible Buffer Insertion Sites 31 Independementioning
confidence: 99%
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“…On one hand, designs with hundreds of million transistors are already in production, IP modules are widely reused, and a large number of buffer blocks are used for delay optimization as well as noise reduction in very deep-submicron interconnect-driven floorplanning [1, 7,11,13,21], which all drive the need of a tool to handle large-scale building modules. On the other hand, the highly competitive IC market requires faster design convergence, faster incremental design turnaround, and better silicon area utilization.…”
Section: Introductionmentioning
confidence: 99%
“…Until recently, all previous congestion models in literature divide the whole chip area into tiles [2,3,4,5,6]. The number of wires crossing a tile boundary is estimated and is used as a measure of congestion.…”
Section: Previous Workmentioning
confidence: 99%