Scalability on Roll-to-Roll Gravure Printed Dielectric Layers for Printed Thin Film Transistors

Yi, Minjin; Yeom, Dongsun; Lee, Wookyu; Jang, Sunghan; Cho, Gyoujin

doi:10.1166/jnn.2013.7060

Cited by 14 publications

(9 citation statements)

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“…In their case, a stack of silver/dielectric/silver was produced that was used as a wiring pattern to drive R2R assembled LED arrays. Also Yi et al have studied the R2R gravure printing of silver nanoparticle pastes on PET film at 6 m min −1 and the subsequent overprinting of the resulting conductive structures with a dielectric BaTiO 3 ink, also by R2R gravure printing, but at varying speeds of 4, 6, and 8 m min −1 . Their key focus was on the optimization of the printing parameters for the dielectric ink to result in smooth and defect‐free dielectric layers, and they demonstrated that the aspect ratio of the ink cells in the gravure roll is the dominant factor in this respect.…”

Section: Printed Circuitry and Electric Connectionsmentioning

confidence: 99%

“…Scalability of production processes is another important issue, which was investigated by Yi et al, who optimized a number of R2R gravure printing and drying parameters (web speed, cell geometry, drying temperature) for silver nanoparticle based conductive and BaTiO 3 based dielectric inks. Their primary goal was to optimize layer thicknesses and surface morphology and device yields for the capacitors of 100% were reported . A decisive materials property for the printed semiconductor materials is their charge carrier mobility, whereas the transistor devices themselves are typically characterized by their on/off ratio.…”

Section: Transistors and Logicmentioning

confidence: 99%

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Roll‐to‐Roll Fabrication of Solution Processed Electronics

Abbel¹,

2018

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The production of electronic devices using solution based ("wet") deposition technologies has some decisive technical and commercial advantages compared to competing approaches like vacuum based ("dry") manufacturing. Particularly, the potential to scale up production processes to large areas and high volumes by introducing continuous roll-to-roll (R2R) methods on flexible substrates has been the topic of intense studies from both applied research institutes and industry already for some years. Decisive steps forward have been achieved during that time, resulting in the dawn of commercial applications for a number of processes, while additional development work is still needed in some other fields. This review summarizes the work published during the last few years on the R2R printing and wet coating of electronic devices. An overview is presented of the basic operational principles for the most commonly used R2R printing and coating methods and techniques for proper web handling in R2R lines. Then, the most commonly used types of flexible substrate materials are introduced, followed by a review of the work published in the application areas of transparent conductor materials, printed electric connections, light emitting devices, photovoltaic energy generation, printed logic, and sensing.

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Section: Printed Circuitry and Electric Connectionsmentioning

confidence: 99%

Section: Transistors and Logicmentioning

confidence: 99%

Roll‐to‐Roll Fabrication of Solution Processed Electronics

Abbel¹,

2018

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“…For direct metal printing, metal nanoparticles such as silver, copper, and gold are commonly used for nanoparticle‐based solutions, which enable solution‐based printing processes. Various printing methods have been developed, including inkjet, roll‐to‐roll gravure, flexography, nanoimprinting, microcontact, and screen‐printing . Among the direct printing techniques, screen‐printing is one of the most versatile methods and it has the advantages of low‐cost processing, large‐area patternability, and eco‐friendly manufacturing procedures.…”

Section: Introductionmentioning

confidence: 99%

Enhancing Adhesion of Screen‐Printed Silver Nanopaste Films

Kim

Jang

et al. 2015

Adv Materials Inter

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such as silicon, paper, polymer, and fabric. Therefore, the screen-printing method has been widely adopted for electronic circuits using metal nanoparticles, [ 8,15,16 ] organic light-emitting devices, [ 17,18 ] and for energy conversion devices, including solar, [ 12,19,20 ] and fuel cells. [ 21,22 ] Despite the advantages of the solution-based screen-printing process, the reliability of printed metal nanoparticle fi lms has always been a concern due to their limited mechanical characteristics. The printed electronic devices are often exposed to harsh operating environments, such as high humidity, mismatch in coeffi cients of thermal expansion (CTE), and repeated loading/unloading. Furthermore, the reliability problems become critical for fl exible electronics due to large deformations that result from their stretchable and bendable characteristics. These issues cause mechanical damage in printed fi lms, including cracks and delamination. Subsequently, they cause mechanical/electrical degradation in the devices. The mechanical properties and reliabilities of printed metal nanoparticle fi lms have therefore been investigated using various techniques, such as tensile, [23][24][25] bending, [ 15 ] and indentation tests. [ 26 ] Nevertheless, the characteristics of interfacial adhesion between the printed fi lms and the substrate that directly infl uence mechanical reliability have received little attention and have not been systematically investigated. Previous interfacial adhesion studies on printed metal nanoparticle fi lms using peel, [ 27 ] friction, [ 28 ] and shear tests [ 29 ] were indirect approaches without fundamental mechanisms. Although the adhesion properties using double cantilever beam (DCB) test have been reported, [ 30 ] it was limited only to the spin-coated silver ink for inkjet applications with impractical sintering times of a few hours. Considering the signifi cant technological and industrial importance of screen-printed metal nanopastes in electronic devices, it is essential to enhance the interfacial adhesion properties and to investigate the fundamental adhesion mechanisms. However, the adhesion of screen-printed metal nanopaste has not been systematically studied.In this study, we quantify the interfacial fracture energy of screen-printed Ag nanopaste fi lms on silicon substrates using DCB fracture mechanics tests. The results demonstrate that the interfacial fracture energy can be maximized at the optimum sintering temperature. To verify the interfacial adhesion mechanism of the screen-printed Ag nanopaste fi lms, the microstructures of fi lms and delaminated surfaces are characterized using scanning electron microscopy (SEM), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). Notably, The interfacial fracture energy of screen-printed silver nanopaste fi lms is quantitatively measured, and the fundamental adhesion mechanism is investigated. It is found that the interfacial fracture energy at the Ag fi lm/ silicon substrate interface is critically affected by the si...

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“…[17][18][19][20] The processing characteristics and demonstrated performance of OFETs suggested that they can be competitive for existing or novel applications requiring large-area coverage, structural flexibility, low-temperature processing, and, especially, low-cost processing. [21][22][23][24][25][26] Most OSCs are processed in low temperature by solution processes such as spin-coating, [27][28][29][30] inkjet printing, 22 31-40 and bar coating. 41 42 This feature can dramatically lower the manufacturing cost in processing compared to those traditional inorganic semiconductors.…”

Section: Organic Field-effect Transistorsmentioning

confidence: 99%

Organic Field-Effect Transistors by a Solvent Vapor Annealing Process

Liu¹,

Khim²,

Noh³

2014

j. nanosci. nanotech.

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Organic field-effect transistor (OFET) attracts great interests from scientific research and industrial application because of its low-cost fabrication and excellent mechanical flexibility. Yet the charge carrier mobility of typical OFET is still around 1-5 cm2/Vs and needs to be further enhanced, ideally by cost effective processes or treatments. Here we review one of the straightforward but effective methods, solvent vapor annealing (SVA), to improve the crystallinity of organic semiconductor film leading enhancement of charge carrier mobility in OFETs. We start by introducing the basic mechanism of SVA, followed by experimental works on small molecules and then conjugated polymers. Along with those examples, we discuss the important factors in using SVA to form highly crystalline conjugated molecule films or organic single crystals to achieve high performance OFETs.

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Scalability on Roll-to-Roll Gravure Printed Dielectric Layers for Printed Thin Film Transistors

Cited by 14 publications

References 0 publications

Roll‐to‐Roll Fabrication of Solution Processed Electronics

Roll‐to‐Roll Fabrication of Solution Processed Electronics

Enhancing Adhesion of Screen‐Printed Silver Nanopaste Films

Organic Field-Effect Transistors by a Solvent Vapor Annealing Process

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