Scalable Fabrication of Strongly Textured Organic Semiconductor Micropatterns by Capillary Force Lithography

Jo, Pil Sung; Vailionis, Artūras; Park, Young Min; Salleo, Alberto

doi:10.1002/adma.201200524

Cited by 66 publications

(51 citation statements)

References 23 publications

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“…A primary step in solution-based organic semiconductor processing is the formation of a thin liquid–solution layer on a substrate surface, produced either by spin coating, casting, dipping or painting (that is, printing)1234567. The thickness of the solution layer typically ranges between 0.1–100 μm, from which thin solid films 10–1,000 nm in thickness are obtained by the subsequent evaporation of solvent.…”

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confidence: 99%

“…solvents owing to the temporary nature of the film formation, although their use is effective for achieving highly crystalline films15. Contact cast methods, which include blade coating or slot-die coating in a broad sense, are utilized to confine the solution to a thin narrow space using a contact plane such as a metal bar, or a glass or plastic plate1246. Using these techniques, the substrate surfaces can be wetted by capillary force, while solvent evaporation occurs only at the solution–air interface located at the edges of the contact plane.…”

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confidence: 99%

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Simple push coating of polymer thin-film transistors

et al. 2012

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confidence: 99%

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confidence: 99%

Simple push coating of polymer thin-film transistors

et al. 2012

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“…To address the above challenges, various groups have developed methods to pattern OSCs (3,9,(13)(14)(15)(16)(17)(18)(19)(20)(21)(22)(23)(24), such as templating OSCs (14,(19)(20)(21), inkjet printing (9,18), gravure printing, and other roll-to-roll coating methods (25)(26)(27). In addition, the use of solvent wetting/dewetting surface treatments has been widely used in conjunction with the patterning methods described above (10, 11, 13, 15-17, 22, 28, 29).…”

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confidence: 99%

Large-area formation of self-aligned crystalline domains of organic semiconductors on transistor channels using CONNECT

Park

Giri

Shaw

et al. 2015

Proc. Natl. Acad. Sci. U.S.A.

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The electronic properties of solution-processable small-molecule organic semiconductors (OSCs) have rapidly improved in recent years, rendering them highly promising for various low-cost largearea electronic applications. However, practical applications of organic electronics require patterned and precisely registered OSC films within the transistor channel region with uniform electrical properties over a large area, a task that remains a significant challenge. Here, we present a technique termed "controlled OSC nucleation and extension for circuits" (CONNECT), which uses differential surface energy and solution shearing to simultaneously generate patterned and precisely registered OSC thin films within the channel region and with aligned crystalline domains, resulting in low device-to-device variability. We have fabricated transistor density as high as 840 dpi, with a yield of 99%. We have successfully built various logic gates and a 2-bit halfadder circuit, demonstrating the practical applicability of our technique for large-scale circuit fabrication.organic semiconductors | patterning | small molecules | transistors | circuits

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“…Obviously, the full filling of functional liquid-like (thermoplastic, UV-or thermocurable) materials into the cavities of a mold at atmospheric pressure would be highly desirable for the accuracy and yield of various molding processes, including micro/nanoimprinting 11,12 capillary force lithography, 13,14 micromolding in capillaries, 15−17 microtransfer molding (μTM), 18,19 and so forth, which were claimed to be of a nanoscale resolution. However, this has been difficult, if not impossible, especially for a mold structure with high aspect ratio, varying size/shape, or isolated cavities (deep microholes or isolated trenches, pockets of varying sizes, for instance), within which the air can inevitably be trapped during the molding process.…”

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Electrowetting Assisted Air Detrapping in Transfer Micromolding for Difficult-to-Mold Microstructures

Tian

Wang

et al. 2014

ACS Appl. Mater. Interfaces

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As a widely applicable process for fabricating micro- or nanostructures, micromolding in atmosphere would require the removal or minimization of air-trapping in mold cavities so as to fill the liquid prepolymer fully into the mold for generating an exact polymer duplicate. This has been difficult, if not impossible, especially for a mold with high aspect ratio, varying size/shape, or isolated cavities because the air can be trapped inside such mold cavities in most variants of the molding process. This paper presents an electrowetting assisted transfer micromolding process to solve this problem. A feeding blade continuously supplies a UV-curable prepolymer over a dielectric-coated conductive mold placed on a progressively advancing stage. A voltage applied to the electrode pair composed of the feeding blade and mold generates an electrowetting of the prepolymer to the mold. The electrowetting allows for the three-phase contact line to pass progressively along the sidewalls and bottoms of the cavities, completely pushing out the air initially occupying the cavities, or generates an electrocapillary force large enough to pull the prepolymer deeply into the mold by compressing the air already trapped inside the cavities to a minimized volume. An experiment has been performed for micromolding with deep cavities of various shapes and sizes, demonstrating an essential improvement in the structural integrity of the polymer duplicates.

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Scalable Fabrication of Strongly Textured Organic Semiconductor Micropatterns by Capillary Force Lithography

Cited by 66 publications

References 23 publications

Simple push coating of polymer thin-film transistors

Simple push coating of polymer thin-film transistors

Large-area formation of self-aligned crystalline domains of organic semiconductors on transistor channels using CONNECT

Electrowetting Assisted Air Detrapping in Transfer Micromolding for Difficult-to-Mold Microstructures

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