Scalable in-situ surface-coated polymer dielectrics with significantly enhanced high-temperature breakdown strength

Dong, Jiufeng; Hu, Renchao; Niu, Yujuan; Li, Li; Li, Shuai; Sun, Liang; Liu, Yuqi; Deng, Xinglei; Li, Liuting; Xu, Xinwei; Pan, Zizhao; Wang, Hong

doi:10.1016/j.mtener.2022.101158

Cited by 14 publications

(13 citation statements)

References 44 publications

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“…The increased deep traps can restrain the de‐trapping and migration of the injected charges, thus the leakage current and conduction loss are significantly reduced at elevated temperatures and high electric fields. [ 48 ]…”

Section: Resultsmentioning

confidence: 99%

“…The increased deep traps can restrain the de-trapping and migration of the injected charges, thus the leakage current and conduction loss are significantly reduced at elevated temperatures and high electric fields. [48] To gain insights into the effects of additive NH 2 -POSS on the molecular energy levels of PI hybrid film, the density functional theory (DFT) calculations were carried out at the B3LYP/6-31G** level using the Gaussian 16 program. [49][50][51] Two repeating units of each polymer were chosen to approximate the polymer since the bandgaps of PI and its derivative are insensitive to the length of chains.…”

Section: Electrical Conduction and Origin Of Trapsmentioning

confidence: 99%

“…It is a known fact that the high-field leakage currents of polymer dielectrics are closely related to the breakdown performance, which is characterized to indicate the transportation behaviors of mobile charge carriers in the composites before breakdown. [2,48] The high field conduction loss was largely reduced by introducing the NH 2 -POSS into PI molecular chain. As seen in Figure S18 (Supporting Information), at 400 MV m −1 and 200 °C, the conduction loss decreases from 32% of PI to 6.7% of PI-3.0 hybrid film.…”

Section: Dielectric Properties and Capacitive Performancementioning

confidence: 99%

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Scalable Polyimide‐Organosilicate Hybrid Films for High‐Temperature Capacitive Energy Storage

Dong

Qiu

et al. 2023

Advanced Materials

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well drilling. [1][2][3] Nowadays, dielectric materials with excellent high-temperature capacitive properties are in great demand because of the heat inevitably generated by compact high-power electronic systems. [4][5][6][7] For example, the operating temperature of capacitors is 140-150 °C in green-energy vehicle inverters and reaches 200 °C in electrified aircraft. Biaxially oriented polypropylene (BOPP), the mainstream commercial polymer dielectrics, has discharged energy densities (U e ) <4.0 J cm −3 and a maximum operating temperature below 105 °C. [5,8,9] Therefore, developing dielectric polymers with high working temperatures and large energy storage densities is of critical importance.The current high glass-transitiontemperature (T g ) dielectric polymers, including polyimide (PI), polyetherimide (PEI), polyetheretherketone (PEEK), and fluorene polyester (FPE), usually exhibit low breakdown strength (E b ) and poor capacitive performance at >150 °C because of an exponential increase in conduction loss with the applied field and temperature. [5,10,11] There are two types of conduction mechanisms in dielectrics, i.e., electrode-limited and bulk-limited conduction mechanisms. [6,[12][13][14][15][16][17] Unlike the electrode-limited conduction mechanism that depends on the electrode-dielectric interface, the bulk-limited conduction mechanism is determined by the electrical characteristics High-temperature polymer dielectrics have broad application prospects in next-generation microelectronics and electrical power systems. However, the capacitive energy densities of dielectric polymers at elevated temperatures are severely limited by carrier excitation and transport. Herein, a molecular engineering strategy is presented to regulate the bulk-limited conduction in the polymer by bonding amino polyhedral oligomeric silsesquioxane (NH 2 -POSS) with the chain ends of polyimide (PI). Experimental studies and density functional theory (DFT) calculations demonstrate that the terminal group NH 2 -POSS with a wide-bandgap of E g ≈ 6.6 eV increases the band energy levels of the PI and induces the formation of local deep traps in the hybrid films, which significantly restrains carrier transport. At 200 °C, the hybrid film exhibits concurrently an ultrahigh discharged energy density of 3.45 J cm −3 and a high gravimetric energy density of 2.74 J g −1 , with the charge-discharge efficiency >90%, far exceeding those achieved in the dielectric polymers and nearly all other polymer nanocomposites. Moreover, the NH 2 -POSS terminated PI film exhibits excellent charge-discharge cyclability (>50000) and power density (0.39 MW cm −3 ) at 200 °C, making it a promising candidate for high-temperature high-energy-density capacitors. This work represents a novel strategy to scalable polymer dielectrics with superior capacitive performance operating in harsh environments.

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Section: Resultsmentioning

confidence: 99%

Section: Electrical Conduction and Origin Of Trapsmentioning

confidence: 99%

Section: Dielectric Properties and Capacitive Performancementioning

confidence: 99%

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Scalable Polyimide‐Organosilicate Hybrid Films for High‐Temperature Capacitive Energy Storage

Dong

Qiu

et al. 2023

Advanced Materials

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“…The breakdown strength, due to space charge movement, is considered an important parameter in the dielectric material. − The characteristic dielectric breakdown strength is analyzed as follows P ( E ) = 1 − exp [ − ( E E b ) β ] where P ( E ), E b , E , and β correspond to the cumulative breakdown probability, breakdown strength with 63.2% probability, experimentally measured breakdown strength value, and shape parameter, respectively. The breakdown strengths and shape parameters for the nanocomposite films were measured as well (Figures c,d and S4).…”

Section: Resultsmentioning

confidence: 99%

Enhanced Interfacial and Dielectric Performance for Polyetherimide Nanocomposites through Tailoring Shell Polarities

Zuo

Jiang

Chen

et al. 2023

ACS Appl. Mater. Interfaces

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Polyimide (PI) and its derivative polyetherimide (PEI) have been widely investigated as promising candidates for dielectric energy storage due to their excellent intrinsic features. However, most of the current research for PI- or PEI-based dielectric nanocomposites only focuses on a certain polar group contained in a dianhydride monomer, while there are very few studies on exploring the effect of a series of polar groups derived from various dianhydride monomers on the dielectric properties of nanocomposites. To fill this gap, we herein fabricated and investigated a series of novel hyperbranched polyimides grafted on barium titanate nanoparticles (HBPI@BT) using different dianhydride monomers and their nanocomposites with the PEI matrix. The results showed that sophisticated hyperbranched structures effectively alleviated the incompatibility between fillers and the matrix, thus significantly improving the bonding energy of nanocomposites, especially for HBPI-S@BT/PEI (797.7 kJ/mol). The U d of HBPI-S@BT/PEI reached 8.38 J/cm3, which is 3.3 times higher than that of pure PEI. The HBPI-F@BT/PEI nanocomposites achieved high breakdown strength (∼500 MV/m) and low dielectric loss (0.008) simultaneously. The dielectric constants of HBPI@BT/PEI nanocomposites remained at a stable level from 25 to 150 °C. This work provides us promising hyperbranched structured materials for potentially advanced dielectric applications such as field effect transistors.

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“…For example, PI/P(VDF-HFP) (1.81 J/cm 3 , 71%), 38 BTNFs/PI (1.74 J/cm 3 ), 39 and S−P−S-2 (1.75 J/cm 3 , 75%). 40 Therefore, the sandwich structure we designed can ensure that the polymer possesses temperature energy storage properties at high temperatures, thereby expanding the range of applications for PI-based composite films. It also offers an effective approach to polymer research and development.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

High-Energy-Storage Dielectric Performance of Sandwich PI-Based Composite over a Wide Temperature Range

Tan,

Gao,

Deng

et al. 2023

J. Phys. Chem. C

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The application of film capacitors is limited by their poor energy storage performance and stability at high temperatures. So far, most work has been concentrated on the use of single-dimensional inorganic fillers incorporated into polymers, but it is difficult to improve the breakdown strength and polarization simultaneously, especially at high temperatures (>150 °C). We prepared (Al 2 O 3 −TiO 2 −Al 2 O 3 )/PI composite films by capitalizing on the benefits of distinct dimensional materials in terms of electrical and thermal properties. The experimental results show that through the reasonable multidimensional coordination design, the composite film exceeds many current high-temperature-resistant materials and can be used up to 200 °C. With the optimal filler ratio, the maximum energy density and efficiency could remain as high as 2.31 J/cm 3 and 81% at 200 °C, respectively. This work demonstrates an excellent method to further improve the energy density and discharge efficiency for high-temperature dielectric polymer-based composites.

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Scalable in-situ surface-coated polymer dielectrics with significantly enhanced high-temperature breakdown strength

Cited by 14 publications

References 44 publications

Scalable Polyimide‐Organosilicate Hybrid Films for High‐Temperature Capacitive Energy Storage

Scalable Polyimide‐Organosilicate Hybrid Films for High‐Temperature Capacitive Energy Storage

Enhanced Interfacial and Dielectric Performance for Polyetherimide Nanocomposites through Tailoring Shell Polarities

High-Energy-Storage Dielectric Performance of Sandwich PI-Based Composite over a Wide Temperature Range

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