2010 11th International Symposium on Quality Electronic Design (ISQED) 2010
DOI: 10.1109/isqed.2010.5450507
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Scalable methods for the analysis and optimization of gate oxide breakdown

Abstract: In this paper we first develop an analytic closed-form model for the failure probability (FP) of a large digital circuit due to gate oxide breakdown. Our approach accounts for the fact that not every breakdown leads to circuit failure, and shows a 6-11× relaxation of the predicted lifetime with respect to the ultra-pessimistic area-scaling method. Next, we develop a posynomial-based optimization approach to perform gate sizing for oxide reliability in addition to timing and area.

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Cited by 4 publications
(2 citation statements)
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“…Ageing also one of the important concerns for PUF circuits. As the continuous utilization of the CMOS devices which leads to a progressive degradability of the system performance and the mechanisms which alters the performance of CMOS devices are Negative bias temperature instability (NBTI), Hot Carrier Injection (HCI), temperature dependent die electric break ISSN: 2089-3272  A secure arbiter physical unclonable functions (PUFs) for device authentication … (Anil Kumar Kurra) 119 down (TDDB), positive bias temperature instability (PBTI), electro migration and soft errors are consider as a major causes to alter the properties of a ICs [10]- [12].…”
Section: Mtotal= Mglobal+mlocalmentioning
confidence: 99%
“…Ageing also one of the important concerns for PUF circuits. As the continuous utilization of the CMOS devices which leads to a progressive degradability of the system performance and the mechanisms which alters the performance of CMOS devices are Negative bias temperature instability (NBTI), Hot Carrier Injection (HCI), temperature dependent die electric break ISSN: 2089-3272  A secure arbiter physical unclonable functions (PUFs) for device authentication … (Anil Kumar Kurra) 119 down (TDDB), positive bias temperature instability (PBTI), electro migration and soft errors are consider as a major causes to alter the properties of a ICs [10]- [12].…”
Section: Mtotal= Mglobal+mlocalmentioning
confidence: 99%
“…This enables the indirect quantification of border traps generated during a TDDB degradation test. Furthermore, the enhanced model presented here can be used to inspect, through circuit simulations, the impact of the thin oxide degradation on the performance of analog and digital circuits using well-known methodologies such as those presented in [26,27]. This aids in predicting the conditions that might yield critical damage on actual circuits used at radiofrequencies [19].…”
Section: Introductionmentioning
confidence: 99%