Scalable Printing of High‐Resolution Flexible Transparent Grid Electrodes Using Directed Assembly of Silver Nanoparticles

Abbasi, Salman; Chai, Zhimin; Busnaina, Ahmed

doi:10.1002/admi.201900898

Cited by 19 publications

(17 citation statements)

References 29 publications

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“…The combining method has many virtues such as facile control, a simple process, scalable for industrial production, and compatible with various substrates. The used masks or templates include a PDMS mask, the templates from nature, silicon pillar, bubble template, lithographically patterned transparent substrate, gel crack, stainless steel mesh, etc. ,− According to the demand of the flexible and transparent electrodes, PDMS has been used for the fabrication of the Ag meshes/grids. Wu et al used wrinkled PDMS substrates as templates to guide the assembly of Ag NWs …”

Section: Solution-based Self-assembly Methodsmentioning

confidence: 99%

Fabrication of Silver Mesh/Grid and Its Applications in Electronics

Zhou

Song

2021

ACS Appl. Mater. Interfaces

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With the development of flexible electronics, researchers have endeavored to improve the characteristics of the commonly used indium tin oxide such as brittleness, poor mechanical or chemical stability, and scarcity. Currently, many alternative materials have been considered such as conductive polymers, graphene, carbon nanotubes, metallic nanoparticles (NPs), nanowires (NWs), or nanofibers. Among them, silver (Ag) mesh/grid NPs or NWs have been considered as an excellent substitute due to the good transmittance, excellent electrical conductivity, outstanding mechanical robustness, and cost competitiveness. So far, much effort has been devoted to the fabrication of Ag mesh/grid, and many methods such as printing technology, self-assembly, electrospun, hot-pressing, and atomic layer deposition have been reported. Here printing technologies include jet printing, gravure printing, screen printing, nanoimprint lithography, microcontact printing, and flexographic printing. The solution-based self-assembly usually combines with coating, template, or mask assistance. This review summarizes the characteristics of these fabrication methods for the Ag mesh/grid with its related applications in electronics. Then the prospect and challenges of the fabrication methods are discussed, and the new preparation approaches and applications of the Ag mesh/grid are highlighted, which will be of significance for the applications in electronics such as transparent conducting electrodes, organic light-emitting diode, energy harvester, strain sensor, cells, etc.

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Section: Solution-based Self-assembly Methodsmentioning

confidence: 99%

Fabrication of Silver Mesh/Grid and Its Applications in Electronics

Zhou

Song

2021

ACS Appl. Mater. Interfaces

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“…Using the fluidic/convective assembly process, Abbasi et al 109 fabricated silver grid electrodes with a high resolution (line width 2 μm) over centimeter-sized flexible poly(ethylene terephthalate) (PET) substrates. Because of the narrow line width, light can pass through with a high average transmittance of >92% in the visible light range.…”

Section: Fluidic Flow-directed Assemblymentioning

confidence: 99%

“…Directed assembly has been developed into a potentially powerful tool for the fabrication of electronics and sensors. ,− In the directed assembly process, external fields such as electric, − magnetic, − optical, − and fluid flow − are applied to nanoelements to generate driving forces that direct the nanoelements to target substrates that, when combined with lithography techniques for substrate functionalization, allows site-selective fabrication of functional structures (Figure ).…”

mentioning

confidence: 99%

Directed Assembly of Nanomaterials for Making Nanoscale Devices and Structures: Mechanisms and Applications

2022

Self Cite

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Nanofabrication has been utilized to manufacture one-, two-, and threedimensional functional nanostructures for applications such as electronics, sensors, and photonic devices. Although conventional silicon-based nanofabrication (top-down approach) has developed into a technique with extremely high precision and integration density, nanofabrication based on directed assembly (bottom-up approach) is attracting more interest recently owing to its low cost and the advantages of additive manufacturing. Directed assembly is a process that utilizes external fields to directly interact with nanoelements (nanoparticles, 2D nanomaterials, nanotubes, nanowires, etc.) and drive the nanoelements to site-selectively assemble in patterned areas on substrates to form functional structures. Directed assembly processes can be divided into four different categories depending on the external fields: electric field-directed assembly, fluidic flowdirected assembly, magnetic field-directed assembly, and optical field-directed assembly. In this review, we summarize recent progress utilizing these four processes and address how these directed assembly processes harness the external fields, the underlying mechanism of how the external fields interact with the nanoelements, and the advantages and drawbacks of utilizing each method. Finally, we discuss applications made using directed assembly and provide a perspective on the future developments and challenges.

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“…Therefore, metal NWs are considered the most promising materials for preparing high-performance TEs. 10,11 With the control level development of the NW distribution, the metal NW matrix conductive FTEs have experienced three development stages, namely, in randomly distributed NW networks, 12,13 two-dimensional (2D) grids, 14 and three-dimensional (3D) grids. 15 In the earlier stage, most research just focused on randomly distributed metal NW networks, due to the low control level of the metal NW distribution on FTE substrates.…”

Section: Introductionmentioning

confidence: 99%

High-Wettability Poly(dimethylsiloxane) Substrate for Ultrastable Conductive Three-Dimensional Woven Ag Nanowire Grids

Zhao

Zhai

et al. 2023

ACS Appl. Mater. Interfaces

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woven Ag nanowire (AgNW) grids have great potential for enhancing the mechanical stabilities, conductivity, and transmittance of flexible transparent electrodes (FTEs). However, it is a great challenge to control the formation of 3D woven AgNW grids on various substrates, especially the poly(dimethylsiloxane) (PDMS) substrate. This work presents a microtransfer-printing method for preparing a high-wettability poly(dimethylsiloxane) (PDMS) substrate to control the formation of 3D woven AgNW grids. The as-prepared PDMS substrate shows a high wettability performance. The surface structures of the PDMS substrate can control the sharp shrinkage of the ink membrane to give rise to a uniform liquid membrane evaporation behavior, which is the key factor for preparing a uniform 3D woven nanowire network. A thin uniform 3D woven AgNW network with a low sheet resistance of 24.3 Ω/□ and high transmittance of 92% was coated on the PDMS substrate. The networks directly coated the surface of the replicated PDMS, which simplified the peeling process and protected the networks from peeling strain and mechanical deformations. Moreover, the increment of resistance retained a small value (∼5%) when bending cycles reached 9,000. An alternating current electroluminescent (ACEL) device was prepared, and the uniform electroluminescence implies that a defect-free electrode has been fabricated. These results indicate that the as-prepared FTEs have excellent mechanical performance and great potential for flexible optoelectronic applications.

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Scalable Printing of High‐Resolution Flexible Transparent Grid Electrodes Using Directed Assembly of Silver Nanoparticles

Abstract: COMMUNICATION 1900898 (1 of 7)

Cited by 19 publications

References 29 publications

Fabrication of Silver Mesh/Grid and Its Applications in Electronics

Fabrication of Silver Mesh/Grid and Its Applications in Electronics

Directed Assembly of Nanomaterials for Making Nanoscale Devices and Structures: Mechanisms and Applications

High-Wettability Poly(dimethylsiloxane) Substrate for Ultrastable Conductive Three-Dimensional Woven Ag Nanowire Grids

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