2005
DOI: 10.1109/tasc.2005.847664
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Scale Up of Applications-Ready Practical Y-Ba-Cu-O Coated Conductors

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Cited by 38 publications
(22 citation statements)
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“…Reproducible, efficient and rapid manufacturing process is still required for practical electric power as well as for high field magnet applications. Manuscript Among the various methods to fabricate long coated conductors, metal organic chemical-vapor-deposition (MOCVD) is promising to achieve high critical current and speed-up the process [1]- [6]. It's because MOCVD has an advantageous capability to enlarge deposition area with high deposition rate [1], [4].…”
Section: Rapid Formation Of 200 M-long Ybco Coatedmentioning
confidence: 99%
“…Reproducible, efficient and rapid manufacturing process is still required for practical electric power as well as for high field magnet applications. Manuscript Among the various methods to fabricate long coated conductors, metal organic chemical-vapor-deposition (MOCVD) is promising to achieve high critical current and speed-up the process [1]- [6]. It's because MOCVD has an advantageous capability to enlarge deposition area with high deposition rate [1], [4].…”
Section: Rapid Formation Of 200 M-long Ybco Coatedmentioning
confidence: 99%
“…The superconducting property is given by the power law characteristic. The equivalent conductivity of the superconductor is derived as (2) where is the critical current density and . The AC loss was calculated from the temporal evolution of electromagnetic field distribution.…”
Section: A Electromagnetic Field Analysis In Cross Section Of Conducmentioning
confidence: 99%
“…T HIS possibility of HTS cables using YBCO coated conductors (Y-CCs) is discussed recently, because the fabrication technologies for long Y-CCs with large critical currents have been developed [1], [2]. Since a Y-CC is very thin, the AC loss generated in it will be very small if the magnetic field is completely parallel to its wide face.…”
Section: Introductionmentioning
confidence: 99%
“…Electroplating (Selvamanickam et al 2005) and bonding (Schoop et al 2005) are commonly used techniques for copper stabilizer application. Electroplating provides the benefi ts of rounded corners, which are desirable for high-voltage applications, absence of low melting point solders -thereby extending the usable temperature to 250 °C instead of 150 °C, and the ability to create a completely striated stabilizer for low AC loss multifi lamentary architectures.…”
Section: 3mentioning
confidence: 99%