1986
DOI: 10.1109/edl.1986.26459
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Scaled GaAs MESFET's with gate length down to 100 nm

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Cited by 16 publications
(2 citation statements)
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“…We measured an increased transconductance for higher drain voltages reaching values as high as 1750 mS/ mm. We also noted that unlike other GaAs MESFET's, breakdown is not determined by gate-drain diode breakdown [l] or punchthrough [3] (for experimental results, see also [4] and [ 5 ] ) . Instead we show that breakdown is caused by a positive feedback mechanism between electron-hole pair generation at the drain end and a parasitic lateral bipolar transistor in parallel with the MESFET.…”
mentioning
confidence: 95%
“…We measured an increased transconductance for higher drain voltages reaching values as high as 1750 mS/ mm. We also noted that unlike other GaAs MESFET's, breakdown is not determined by gate-drain diode breakdown [l] or punchthrough [3] (for experimental results, see also [4] and [ 5 ] ) . Instead we show that breakdown is caused by a positive feedback mechanism between electron-hole pair generation at the drain end and a parasitic lateral bipolar transistor in parallel with the MESFET.…”
mentioning
confidence: 95%
“…(3-c). By observing the magnitude of I g it is evident that the interfacial layer is of nominal thickness and the device depletion is predominantly controlled by the Schottky barrier gate [5,10]. Figure (4) represents characteristics of a device (A4-74-10) having the same fabrication parameters as that of the device of Fig.…”
Section: Ii-interfacial Layer Currentmentioning
confidence: 97%