“…This defect generation process is taken to occur in competition with an opposite process, named defect recovery, which mimics the healing mechanisms. Electromigration of metallic lines 4,26 instability of the electrical properties of composites or semicontinuous metal films 2,3 , 13-19 , 22,23 or soft dielectric breakdown of ultra-thin oxides 4,29 , are examples of phenomena that can be successfully described by this approach 25,31,[49][50][51] . In the case of electromigration phenomena, for example, the defect generation corresponds to the formation of voids induced by the electronic wind, while the defect recovery is related to the void healing due to mechanical stress and thermal gradients inside a metallic film 4,26 .…”