Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV 2020
DOI: 10.1117/12.2545065
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Scaling percussion drilling processes by ultrashort laser pulses using advanced beam shaping

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Cited by 3 publications
(9 citation statements)
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“…For this purpose, long-working distance microscope objectives with NAs up to 0.5 are available. 6,60 As mentioned in the beginning of this section, the modification step is only one part of the entire cutting process. The actual separation process remains challenging especially if Fig.…”
Section: Laser Cutting Of Transparent Materialsmentioning
confidence: 99%
See 3 more Smart Citations
“…For this purpose, long-working distance microscope objectives with NAs up to 0.5 are available. 6,60 As mentioned in the beginning of this section, the modification step is only one part of the entire cutting process. The actual separation process remains challenging especially if Fig.…”
Section: Laser Cutting Of Transparent Materialsmentioning
confidence: 99%
“…14 and employs an SLM as central beam shaping element. 60 were directly marked onto the substrate's surface-no scanning system was required. Another challenging application that can benefit from appropriate beam shaping flexibility is the percussion drilling of rectangular holes in thin metal foils (FMMs).…”
Section: Laser Surface Structuring and Percussion Drillingmentioning
confidence: 99%
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“…For this purpose, long-working distance microscope objectives with NAs up to 0.5 are available. 6,55 As mentioned in the beginning of this section, the modification step is only one part of the entire cutting process. The actual separation process remains challenging especially if comparatively thin < 0.3 mm and thick glasses > 2 mm need to be separated.…”
Section: (B)]mentioning
confidence: 99%