Scanning thermal lithography: Maskless, submicron thermochemical patterning of photoresist by ultracompliant probes

Basu, Amar S.; McNamara, Shamus; Gianchandani, Yogesh B.

doi:10.1116/1.1808732

Cited by 43 publications

(27 citation statements)

References 12 publications

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“…Since the probe is made of silicon with a flat top surface, several functional components, including UV emitting LED or simple resistive heater, can be readily integrated on the surface. The result shows promise for further various nano-scale patterning methods such as UV or heat-induced crosslinking [19] of photoresist. …”

Section: Imagingmentioning

confidence: 92%

Single monolayer nanocrystal LED on probe tip for near-field molecular imaging and patterning

Hoshino

Gopal

Ostrowski

et al. 2008

2008 IEEE 21st International Conference on Micro Electro Mechanical Systems

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We report a novel light emitting nano-diode structure consisting of a single monolayer of CdSe nanocrystals deposited on a scanning probe tip for Near-field Scanning Optical Microscopy (NSOM). P-doped silicon which forms the probe body was utilized as an anode of the LED. A Langmuir -Blodgett (LB) trough was used to deposit on-probe a monolayer of nanocrystals (5-10 nm thickness), which were then examined with a SEM/TEM to show uniform deposition, and a fluorescent microscope to demonstrate light emitting properties. Both photoluminescent and electroluminescent emissions were observed from the fabricated probe with monolayer LED. Preliminary imaging and patterning using functional light emitting silicon probes were demonstrated in a standard NSOM setup. Resolutions of 50 nm and 400 nm were acquired for topographic and optical imaging, respectively.

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Section: Imagingmentioning

confidence: 92%

Single monolayer nanocrystal LED on probe tip for near-field molecular imaging and patterning

Hoshino

Gopal

Ostrowski

et al. 2008

2008 IEEE 21st International Conference on Micro Electro Mechanical Systems

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“…It was previously reported elsewhere that thin and soft polymer or PR films could be mechanically patterned in nanometer scale when an AFM tip with sufficient tension was scanned over the film surface with being loaded downward in contact mode. [22][23][24] The so-called direct lithography using an AFM tip is a simple, maskless, and relatively cheap process. We scratched PR-coated specimens mechanically by managing the movement of AFM tip manually.…”

Section: Methodsmentioning

confidence: 99%

Electrochemical Formation of Cu Nanowires on W Surface Patterned by Atomic Force Microscope Tip

Kim¹,

Park²,

Kim³

2011

Electrochem. Solid-State Lett.

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Cu nanowires are directly patterned on W diffusion barrier surface by electrodeposition without using any template. Prior to Cu nanowire growth, a photoresist (PR) film coated over the W surface was mechanically patterned in a random manner with atomic force microscope (AFM) tip. Polycrystalline Cu nanowires in the shape of beaded string were electrochemically formed along line patterns on the W surface. This new approach of Cu nanowire synthesis suggests the feasibility of fabricating Cu interconnects for Si-based electronic devices by direct Cu nanowire patterning.

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“…-Ultra-large-scale integration lithography research and cellular diagnostics in biochemistry [25,28,29,30] -Detecting parameters such as phase changes in metallic alloys and ceramics [31] -Measuring material variations in semiconductor devices [32] -Near-field photothermal microspectroscopy [34] -Analyzing enthalpy in integrated circuits.…”

Section: Existing Applicationsmentioning

confidence: 99%

Advanced Post-Irradiation Examination Capability T

Listed¹

2013

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This report describes the current status of the Advanced Post-Irradiation Examination Capability (APIEC) Project and the initial complement of post-irradiation examination (PIE) instruments proposed to advance the state-ofthe-art for nuclear characterization. To facilitate this advancement, the project performed a technical readiness assessment for the instruments that are most likely to be used for the APIEC Project. This assessment assigned technology readiness levels (TRLs) for the current-state instrument and system readiness.Technology maturation plans (TMPs) were developed for each of the PIE instruments in the initial complement to detail the next steps required to test the instruments and reduce the risk of installing immature technologies. An additional TMP was developed for the sample preparation equipment needed to prepare nuclear fuels and material specimens for advanced PIE. Technology development roadmaps were then generated to summarize the path forward to successful operation in a facility. The technology development roadmaps, current TRLs, and a brief description of each capability and instrument are contained herein. The nine TMPs are included as attachments to this report.This assessment included 20 candidate instruments. These instruments ranged in technology readiness from instruments that have been successfully tested as integrated components to instruments that have been demonstrated as a system in their final configuration. Many of these instruments are commercially available and have been demonstrated in industrial applications. However, some have not been demonstrated for personnel and equipment protection in the high-radiation environment anticipated for the APIEC Project. Hence, these instruments need to be demonstrated in dry inert atmosphere, radiation service (e.g., shielding or relocation of the detectors and printed circuit boards), remote sample handling, and, in some cases, remote control and maintenance of the instrument.This report describes, qualitatively, the challenges facing each instrument and the path forward to overcome those challenges. As the initial complement of instruments anticipated for near-term APIEC Project application is finalized, more details will be added to the test plans to further quantify the path forward. Updates and additional details also will be added as the instruments advance through successive TRLs. INTRODUCTIONThis document describes the current status of the instruments that will be used to advance the state-of-the-art for nuclear characterization in the Advanced Post-Irradiation Examination Capability (APIEC) Project. To facilitate this advancement, the APIEC Project performed a technical readiness assessment (TRA) for the candidate instruments likely to be used in an advanced post-irradiation examination (PIE) facility. This assessment resulted in assignment of technology readiness levels (TRLs) for the current state of each instrument. Technology development roadmaps (TDRMs) and technology maturation plans (TMPs) were developed for the i...

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Scanning thermal lithography: Maskless, submicron thermochemical patterning of photoresist by ultracompliant probes

Cited by 43 publications

References 12 publications

Single monolayer nanocrystal LED on probe tip for near-field molecular imaging and patterning

Single monolayer nanocrystal LED on probe tip for near-field molecular imaging and patterning

Electrochemical Formation of Cu Nanowires on W Surface Patterned by Atomic Force Microscope Tip

Advanced Post-Irradiation Examination Capability T

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