“…By now, numerous approaches like the etching barrier layer [13] and selective Si diffusion [14] have been demonstrated to effectively reduce the onset voltage, but the leakage current is relatively large. In addition, combinations of high/low Schottky barrier metals [15], carbon-doped GaN buffer [16,17], Fe-doped GaN buffer [18], and gated edge termination (GET) [19,20] have been proposed to suppress the reverse leakage, but the double Schottky barrier metal and GET are still a challenging manufacturing issue, and the doped GaN buffer will affect the device’s forward characteristics, especially the on-resistance. The utilization of field plates (FPs), such as anode FPs (AFP) [21] and cathode FPs (CFP), is a simple and effective method to modulate the electric field.…”