BPF integrated amplifier module using LTCC technology for millimeter‐wave applications

Abstract

A compact amplifier module integrating a low‐loss stripline (SL) band‐pass filter (BPF) using low‐temperature cofired ceramic (LTCC) technology is presented for millimeter‐wave (mm‐wave) applications. A parasitic resonance‐free SL BPF is proposed by modifying a distribution of ground vias in the SL LTCC BPF. The SL BPF fabricated in the 6 LTCC layers showed a 3‐dB bandwidth of 8.4% at the center frequency of 41.8 GHz. Its measured insertion and return loss were as small as 1.7 dB and 10.2 dB, respectively. The SL BPF integrated amplifier LTCC module was implemented in the single LTCC substrate in a size of 11.3 × 12.2 × 0.6 mm3. Its gain of 10 dB and output power of 18 dBm is achieved in the pass band from 39.5 to 42 GHz. © 2015 Wiley Periodicals, Inc. Microwave Opt Technol Lett 57:1821–1825, 2015

LTCC-Based System-in-Package (SiP) Technology for Microwave System Integration

“…The modified via placement for the CB-CPW and the SL BPF is presented in each inset of Figure 4A and B, respectively. The parasitic resonant modes are clearly suppressed in the operation frequency region [17]. In the CB-CPW, the distance (D) of 1620 μm is shortened to 700 μm and its layout and measured results are shown in Figure 4A.…”