Epoxy‐functional thermoplastic copolymers and their incorporation into a thermosetting resin

Abstract

The customization of polymer networks can be made possible via dual-functional monomers, molecules characterized by two different reactive substituents that allow for versatile methods of polymerization. The dual-functional, epoxymethacrylate monomers, glycidyl methacrylate (GMA), and vanillyl alcohol epoxy-methacrylate (VAEM), were polymerized with methyl methacrylate (MMA) via reversible addition-fragmentation chain transfer (RAFT) polymerization to form low molecular weight (~10-20 kDa) epoxy-functional thermoplastic copolymers, poly(VAEM-coMMA), and poly(GMA-coMMA). The copolymers were blended at 5 wt% into an epoxy resin system containing EPON Resin 828 and EPIKURE W Curing Agent and cured thermally to create unique interpenetrating polymer networks (IPNs). The resulting IPNs were compared to the cured neat resin and evaluated for thermal and mechanical properties, where maintained thermal properties and enhancements of stiffness and toughness were demonstrated.

Atomistic Modeling of Dual-Cured Thermosets Based on Glycidyl Methacrylate and Hardeners with Various Architecture and Functionality

“…This suggests that the influence of the hardener on the Poisson’s ratio of the polymerized samples is negligible. In an experimental study, Sweet and Stanzione reported a similar value, 0.35, as the Poisson’s ratio of the dual-cured GMA/epoxy system …”

“…In an experimental study, Sweet and Stanzione reported a similar value, 0.35, as the Poisson's ratio of the dual-cured GMA/epoxy system. 41 Future Directions. In future, this methodology will be translated to investigate carbon fiber reinforced polymer composites (CFRPs).…”

Hydroxyl-Free Epoxy Thermoplastics from Active Esters with Low Dielectric Constant and Water Sorption

“…Epoxy-based materials are one class of the most versatile polymers extensively applied in coating, microelectronic packing, and adhesive fields, due to their outstanding mechanical properties and good chemical stability, as well as easy processing, low cost, and commercial abundance. − It is quite well-known that thermosetting epoxy materials can be achieved by curing epoxides with hardeners such as polyfunctional amines, anhydrides, and phenolic esters. − The thermosetting epoxy resin may become brittle and quite fragile to crack growth and propagation after curing due to their high cross-link density, − which hugely limits their application in high-tech fields. Alternatively, high-molecular-weight linear epoxy resins, so-called thermoplastic phenoxy resins, possess high rigidity, ductility, toughness, and creep resistance as compared to the brittle thermosetting ones, and can be ideal alternate and toughening agents to improve the toughness and mechanical properties. − …”

Effect of carbon nanotubes on curing characteristics of low energy electron beam curing CFRPs

“…It's known that the resin toughness has a direct and important impact on the interface and macroscopic mechanical properties of resin matrix composites. [22][23][24][25] However, E-beam curable resin has low toughness, showing poor ability to inhibit crack propagation and is easy to crack under the action of external load, while the cracks extending from the matrix to the interface or the rapid expansion of tiny cracks originally existing at the interface can easily cause the integral de-bonding of the interface and directly lead to the failure of the component destroy. The strength and toughness of the initial electron beam curing resin are even lower than the minimum standard of thermal curing resin.…”