High‐temperature resistance and excellent electrical insulation in epoxy resin blends

Abstract

The packaging insulation material was a crucial component to guarantee the stable and safe operation of electronic devices. Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation, low price, and easy processing and molding. However, the unsatisfied heat resistance cannot meet the requirements of the rapid development of third‐generation power semiconductors, so it was meaningful to modify the epoxy resin with both excellent heat resistance and insulation. In this paper, tetrafunctional epoxy resin AG70 and phenolic epoxy resin F51 was blended in different proportions to combine their individual advantages, and the microstructure and electrical/thermal properties of epoxy resin blends had been systematically studied. The results showed that with the increase of blending ratio of AG70 with F51, both high glass transition temperature of 213.3°C and electric breakdown of 206.1 kV/mm were achieved when the blending ratio was 5:5, displaying excellent overall performances and exhibiting great application potential in electronic and microelectronic industries.

Branched Silicone Acrylates Enhanced Photocurable Epoxy Resins with High Strength, Toughness, and Low Dielectric Constant for SLA 3D Printing

“…Epoxy resins, as one of the most important thermosetting resins, have been widely used as adhesives, semiconductor, and insulation materials in the field of electronic devices, packages, and sensors due to their superior integrated properties. − With the rapid development of electronic technology, the electronics industry tends to manufacture products with high precision, accuracy, structural complexity, and diversity. − 3D printing, known as a revolutionary and innovative manufacturing strategy, appearance enables object fabrication in high resolution, fast printing speed, personalized and cost-effective way over traditional manufacturing. − Among the developed 3D printing technologies, stereolithography (SLA) technology has the highest precision and fabricates complex 3D structures ranging from micrometer-size needles to life-size organs with high resolution and precision. − The materials used in the SLA technique typically are epoxy resins together with small amounts of acrylates to achieve products with low shrinkage, high precision, and strength through cross-linking interaction under UV irradiation. , However, the disadvantages of poor toughness, poor thermostability, and hydrophobicity as well as the low dielectric constant of the epoxy resins have greatly limited its broad application in 3D printing, especially in the electronics field. − …”

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

“…Commonly utilized potting materials predominantly consist of various polymer compositions, such as epoxy resin, polyurethane, polyimide, and so on. Among them, epoxy resin holds a prominent position in electronic packaging and related industries due to its excellent mechanical properties, commendable corrosion resistance, and other inherent advantages [3].…”