Scrapping Small Lots in a Low-Yield and High-Price Scenario

Wu, Muh-Cherng; Chiou, Chie-Wun; Hsu, Hsi-Mei

doi:10.1109/tsm.2003.822732

Cited by 3 publications

(1 citation statement)

References 16 publications

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“…But profitability or cost are not considered within a quantitative objective function framework. A more quantitative cost-oriented approach is taken in dealing with specific problems such as for lot scrapping decisions of small lots in low yield high price scenario by Wu et al [19] or for the evaluation of three-dimensional integrated circuit (3D IC) cost-efficient design by Dong and Xie [20]. Lastly, an optimization framework is presented in [21] for yield improvement and test cost reduction for 3D ICs.…”

Section: Literature Reviewmentioning

confidence: 99%

Optimizing Factory Performance for Unit Cost in Semiconductor Manufacturing

Kalir¹

2023

OJOp

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The integrated circuit (IC) manufacturing process is capital intensive and complex. The production process of unit product (or die, as it is commonly referred to) takes several weeks. Semiconductor factories (fabs) continuously attempt to improve their productivity, as measured in output and cycle time (or mean flow time). The conflicting objective of producing maximum units at minimal production cycle time and at the highest quality, as measured by die yield, is discussed in this paper. The inter-related effects are characterized, and a model is proposed to address this multi-objective function. We then show that, with this model, die cost can be optimized for any given operating conditions of a fab. A numerical example is provided to illustrate the practicality of the model and the proposed optimization method.

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Section: Literature Reviewmentioning

confidence: 99%