2016
DOI: 10.1109/jphotov.2015.2484960
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Screen-Printed Metallization Concepts for Large-Area Back-Contact Back-Junction Silicon Solar Cells

Abstract: In this study, we investigate three screen-printed metallization concepts for back-contact back-junction silicon solar cells with an edge length of 156 mm: 1) a busbar-less concept with periodically interrupted contact fingers for wire-based interconnection; 2) a single-layer concept with printed busbars and periodically interrupted contact fingers; and 3) a multilayer concept consisting of continuous contact fingers, an insulation layer, and busbar metallization. A comprehensive simulation study is presented … Show more

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Cited by 11 publications
(4 citation statements)
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“…Solar cell modeling also considers the metallization of the front and back parts. The geometrical characteristics of the busbars and the fingers are shown in Table 3 [60,61].…”
Section: Geometrical Propertiesmentioning
confidence: 99%
See 1 more Smart Citation
“…Solar cell modeling also considers the metallization of the front and back parts. The geometrical characteristics of the busbars and the fingers are shown in Table 3 [60,61].…”
Section: Geometrical Propertiesmentioning
confidence: 99%
“…Solar cell modeling also considers the metallization of the front and back parts. The geometrical characteristics of the busbars and the fingers are shown in Table 3 [60,61]. As reference, this study considers the approximate experimental values of the heterojunction solar cell a − Si : H/c − Si: open-circuit voltage V oc = 713 mV, short-circuit current density J sc = 37.3 mA/cm 2 , fill factor FF = 75.9%, and energy conversion efficiency η = 20.2%, as measured by Muñoz et al in their study [62,63].…”
Section: Geometrical Propertiesmentioning
confidence: 99%
“…Hendrichs et al . investigated three different screen‐printed metallization concepts for BJBC silicon solar cells with an edge length of 156 mm. They qualified the individual loss mechanisms of each metallization concept and the maximum solar cell conversion efficiency of 22.0% by means of numerical simulations.…”
Section: Introductionmentioning
confidence: 99%
“…The first concept, shown in Fig. 1a, is based on a multi-layer metallization approach [3,4] where the busbar metallization is decoupled from the contact finger metallization by an intermediate insulation layer. It is compatible with ribbon-or foil-based module integration technologies and consists of three consecutively screen-printed layers: the contact finger metallization, the insulation layer, and the busbar metallization.…”
Section: Introductionmentioning
confidence: 99%