ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005. 2005
DOI: 10.1109/issm.2005.1513350
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Scrubber-induced substrate cracks found by data mining analysis

Abstract: In order to improve the yield enhancement speed, we adopt data mining analysis. The root cause of crack in silicon substrate induced by scrubber tool was found by data mining approach. It could not be detected by conventional knowledge-based pre-filtering approach. As a countermeasure, we switched the scrubber from high pressure clean tool to moderate pressure clean tool.

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“…We used multiple linear regressions to obtain the prediction model [27], [28]. The number of variables selected ranged from 14 to 3 to avoid the multicolinearity, obtaining the gate CD prediction model shown as follows:…”
Section: Gate Length Prediction Modelmentioning
confidence: 99%
“…We used multiple linear regressions to obtain the prediction model [27], [28]. The number of variables selected ranged from 14 to 3 to avoid the multicolinearity, obtaining the gate CD prediction model shown as follows:…”
Section: Gate Length Prediction Modelmentioning
confidence: 99%