2013
DOI: 10.1039/c3tc30522h
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Sealed ultra low-k organosilica films with improved electrical, mechanical and chemical properties

Abstract: In this contribution, we present sealed ultra low-k organosilica films that have improved electrical, mechanical and chemical properties. The films consist of a mesoporous ethylene-bridged organosilica layer at the bottom and an almost non-porous cyclic carbon-bridged top layer. This top layer effectively seals metal penetration during atomic layer deposition processes. Furthermore, by applying this sealing approach we can lower the dielectric constant of the pristine mesoporous film from 2.5 to 2.07 while we … Show more

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Cited by 7 publications
(4 citation statements)
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“…1 The ethylene bridge tends to enhance the average micropore size as compared to pure silica, [3][4][5][6] but despite the addition of hydrophobic organic segments the material keeps on having a signicant affinity for water. [6][7][8][9][10] Ethylene-bridged organosilica in mesoporous architectures is particularly interesting as low-k material, 1,11 is UV-responsive upon metal doping 12 and has been used in chiral thermochromic composites. 13 An important application of microporous BTESE-based organosilica is in molecular sieving membranes, [14][15][16] which are being employed industrially.…”
Section: Introductionmentioning
confidence: 99%
“…1 The ethylene bridge tends to enhance the average micropore size as compared to pure silica, [3][4][5][6] but despite the addition of hydrophobic organic segments the material keeps on having a signicant affinity for water. [6][7][8][9][10] Ethylene-bridged organosilica in mesoporous architectures is particularly interesting as low-k material, 1,11 is UV-responsive upon metal doping 12 and has been used in chiral thermochromic composites. 13 An important application of microporous BTESE-based organosilica is in molecular sieving membranes, [14][15][16] which are being employed industrially.…”
Section: Introductionmentioning
confidence: 99%
“…In general, carbon‐bridged organosilicas have low intrinsic dielectric constants and higher Young's moduli than terminal‐methyl organosilicas . PMOs derived specifically from HETSCH and related molecules have been explored as low‐ k dielectric interlayers . Notably, only cylindrical pore HETSCH PMOs have been reported to date.…”
Section: Resultsmentioning
confidence: 99%
“…Notably, only cylindrical pore HETSCH PMOs have been reported to date. Nonetheless, porosities up to 55% have been reported for these anisotropic PMOs, whose dielectric constants were reported as low as 1.8 for HETSCH and 1.6 for methylene‐bridged compounds . Higher porosities would be required to lower those values any further, if desirable.…”
Section: Resultsmentioning
confidence: 99%
“…The position of the organic groups can be terminal (Si–R) or bridging (Si–R’–Si), which affects their exposure at the (internal) surface and influences the crosslink density and microporosity of the network [ 3 ]. Organosilicas can be prepared by mild and versatile sol-gel routes and applications are, for instance, molecular separation membranes [ 4 ], catalysts [ 5 ], low-k materials [ 6 , 7 ] and sensors [ 8 ]. Organosilica networks offer the combined advantage of a mechanically strong yet flexible network.…”
Section: Introductionmentioning
confidence: 99%