Secure Logic Locking with Strain-Protected Nanomagnet Logic

Hassan, Naimul; Edwards, Alexander J.; Bhattacharya, Dhritiman; Shihab, Mustafa M.; Venkat, Varun; Zhou, Peng; Hu, Xuan; Kundu, Shamik; Kuruvila, Abraham Peedikayil; Basu, Kanad; Atulasimha, Jayasimha; Makris, Yiorgos; Friedman, Joseph S.

doi:10.1109/dac18074.2021.9586258

Cited by 3 publications

(2 citation statements)

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“…[116] More recent LL schemes leverage the nonvolatility of nanomagnetic logic (NML). [117] While impressive, the involvement of additional peripheral elements for memristive and spintronic devices make them area and energy inefficient and necessitates alternative LL schemes involving novel channel materials (such as 2D materials). In this context, Appenzeller et al demonstrated an LL scheme using reconfigurable black phosphorus (BP) FETs.…”

Section: D-material-based Ll Of Icsmentioning

confidence: 99%

“…Random LL [111] XOR-based key insertion at random locations Yes SARlock [205] Flipping circuits to corrupt input pattern Yes Anti-SAT [206] Additional anti-SAT combinational blocks Yes TT-Lock [207] Wrong key enabling by flipping output patterns Yes NML [117] Nonvolatility of magnetic logic No Memristive array-based [116] Ta/HfO 2 memristive array with a key destruction scheme No BP-based FET [118] Tunable polarity and reconfigurability of device No MoS 2 -based FET [26] Electrical programming of individual device No and reliability of electronics systems deployed in critical applications such as electronic warfare and military aircraft. [138] While several different types of counterfeits such as cloned, recycled, overproduced, remarked, etc., exist, reports indicate that recycled ICs constitute the majority (≈80%) of all counterfeit ICs.…”

Section: Table 5 Comparison Of Different Ll Techniquesmentioning

confidence: 99%

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Hardware and Information Security Primitives Based on 2D Materials and Devices

Wali

Das

2023

Advanced Materials

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Hardware security is a major concern for the entire semiconductor ecosystem that accounts for billions of dollars in annual losses. Similarly, information security is a critical need for the rapidly proliferating edge devices that continuously collect and communicate a massive volume of data. While silicon‐based complementary metal‐oxide‐semiconductor technology offers security solutions, these are largely inadequate, inefficient, and often inconclusive, as well as resource intensive in time, energy, and cost, leading to tremendous room for innovation in this field. Furthermore, silicon‐based security primitives have shown vulnerability to machine learning (ML) attacks. In recent years, 2D materials such as graphene and transition metal dichalcogenides have been intensely explored to mitigate these security challenges. In this review, 2D‐materials‐based hardware security solutions such as camouflaging, true random number generation, watermarking, anticounterfeiting, physically unclonable functions, and logic locking of integrated circuits (ICs) are summarized with accompanying discussion on their reliability and resilience to ML attacks. In addition, the role of native defects in 2D materials in developing high entropy hardware security primitives is also examined. Finally, the existing challenges for 2D materials, which must be overcome for large‐scale deployment of 2D ICs to meet the security needs of the semiconductor industry, are discussed.

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Section: D-material-based Ll Of Icsmentioning

confidence: 99%