2007
DOI: 10.1016/j.jcrysgro.2006.10.213
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Segregation and desorption of antimony in InP (001) in MOVPE

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Cited by 11 publications
(5 citation statements)
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“…These experiments were carried out on different samples prepared under different conditions and growth methods (namely MBE and MOCVD), and after preparation of the deposited layer, different techniques were then employed to avoid surface contamination. 16,17,[48][49][50] Nevertheless, and in spite of some uncertainty in the baseline position, it is clear that the spectra are all very similar. Hence, the resulting phase is likely to be the same Sb-stabilized phase.…”
Section: Surface Optical Spectramentioning
confidence: 99%
“…These experiments were carried out on different samples prepared under different conditions and growth methods (namely MBE and MOCVD), and after preparation of the deposited layer, different techniques were then employed to avoid surface contamination. 16,17,[48][49][50] Nevertheless, and in spite of some uncertainty in the baseline position, it is clear that the spectra are all very similar. Hence, the resulting phase is likely to be the same Sb-stabilized phase.…”
Section: Surface Optical Spectramentioning
confidence: 99%
“…One is the slight incorporation of Sb in the InP emitter. This is probably due to Sb (surface) segregation [24][25][26][27] and memory effects. An appropriate growth interval process in an As-rich atmosphere before the growth of InP 24,25) and=or the insertion of a GaAs interlayer 28) between the base and the InP emitter might be effective for suppressing this segregation.…”
Section: Sims Analysis and Contact Resistivity Of Compositionally-gra...mentioning
confidence: 99%
“…During the growth of GaAsSb layer, Sb tends to segregate and incorporate into the InP emitter, resulting in a bumpy interface and degraded device performance such as a low current gain as well as a large base current ideality factor [8,9]. Moreover, Arsenic carryover and/or P/As exchange could also occur at this particular interface [10,11]. Therefore, design and growth of high-quality emitter-base junction is of critical importance to a high-performance InP/GaAsSb/InP DHBT.…”
Section: Introductionmentioning
confidence: 99%