Selective-column ball grid array (BGA) for improved reliability

Pandey, Vinayak; Frutschy, Kristopher; McCormick, C.

doi:10.1109/ectc.2005.1441294

Cited by 1 publication

(5 citation statements)

References 1 publication

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“…Cracks can also initiate at the interfaces due to the effect of brittle intermetallics and are not taken into account in FEA simulation. In this experimental study and the experimental study in [18], crack initiation was observed in the bulk solder (Fig. 12) and at the interfaces (Fig.…”

Section: Thermal Cycling Test Resultsmentioning

confidence: 87%

“…12. FEA simulation of hourglass-shaped joints in the literature [18] showed that the location of highest stress in an hourglassshaped joint (maximum inelastic strain and peak strain density) is in the bulk solder. Cracks can also initiate at the interfaces due to the effect of brittle intermetallics and are not taken into account in FEA simulation.…”

Section: Thermal Cycling Test Resultsmentioning

confidence: 99%

“…Mathematical modeling and testing in the literature have shown that hourglass-shaped solder joints have lower strain and thus better fatigue life than traditional barrel-shaped solder joints [18]- [22]. Due to lower solder volume, hourglass-shaped joints are more compliant and flexible and therefore exert less average stress on the package substrate and copper pads.…”

Section: Experimental Test Vehiclementioning

confidence: 99%

“…Contrary to the traditional barrel-shaped solder joints, hourglassshaped joints have the maximum stresses at the central plane of the solder joint (bulk solder) where the section is narrowest and not at the package-solder and solder-board interfaces. Crack growth at the bulk solder joint is driven by cohesive failure, which requires more stress than adhesive failure at the interfaces and thus better fatigue life [18], [19]. However, the manufacturing process of hourglass-shaped joints is neither robust nor repeatable.…”

Section: Experimental Test Vehiclementioning

confidence: 99%

“…However, the manufacturing process of hourglass-shaped joints is neither robust nor repeatable. Limited manufacturing techniques are available to manufacture these joints [18].…”

Section: Experimental Test Vehiclementioning

confidence: 99%

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Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications

George

Das

Osterman

et al. 2011

IEEE Trans. Device Mater. Relib.

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Applications with temperatures higher than the melting point of eutectic tin-lead solder (183 • C) require highmelting-point solders. However, they are expensive and not widely available. With the adoption of lead-free legislation, first in Europe and then in many other countries, the electronics industry has transitioned from eutectic tin-lead to lead-free solders that have higher melting points. This higher melting point presents an opportunity for the manufacturers of high-temperature electronics to shift to mainstream lead-free solders. In this paper, ball grid arrays (BGAs), quad flat packages, and surface mount resistors assembled with SAC305 (96.5%Sn+3.0%Ag+0.5Cu) and Sn3.5Ag (96.5%Sn+3.5%Ag) solder pastes were subjected to thermal cycling from −40 • C to 185 • C. Commercially available electroless nickel immersion gold board finish was compared to custom Sn-based board finish designed for high temperatures. The data analysis showed that the type of solder paste and board finish used did not have an impact on the reliability of BGA solder joints. The failure analysis revealed the failure site to be on the package side of the solder joint. The evolution of intermetallic compounds after thermal cycling was analyzed.Index Terms-Ball grid array (BGA) packages, electroless nickel immersion gold (ENIG), electronics reliability, high temperature, solder, thermal cycling.

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Section: Thermal Cycling Test Resultsmentioning

confidence: 87%

Section: Thermal Cycling Test Resultsmentioning

confidence: 99%

Section: Experimental Test Vehiclementioning

confidence: 99%

Section: Experimental Test Vehiclementioning

confidence: 99%

“…However, the manufacturing process of hourglass-shaped joints is neither robust nor repeatable. Limited manufacturing techniques are available to manufacture these joints [18].…”

Section: Experimental Test Vehiclementioning

confidence: 99%

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