Selective corrosion of β-Sn and intermetallic compounds in an Ag–Sn alloy at different potentials in NaCl and Na2SO4 solutions

Dai, Wei; Liu, Yuanyuan; Huang, Ningge; Lan, Rulei; Zheng, Kangkang; Lu, Yixing; Li, Jin; Jiang, Yiming; Sun, Yangting

doi:10.1016/j.corsci.2022.110958

Cited by 8 publications

(6 citation statements)

References 51 publications

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“…From the XRD diagram, it ca of four phases, such as Cu, Sn, Cu6Sn5, and Cu3Sn phase, f for Sn-Ag/Cu joints, in addition to the four phases described (Ag, Ag3Sn, Ag4Sn) have also been detected. The EDX line-s across the interface (The direction and position of line scan in the figure) were also prove that there are two elements, face, while Sn-Ag/Cu interface has three elements (Sn, Ag peak of the XRD pattern (Figure 3) also directly proves (namely, Ag atom [18,19]). The presence of Ag nanoparticl of Cu-Sn bonds, leading to a faster increase in the thicknes Ag/Cu soldering interface than that at Sn/Cu, as shown in XRD spectrum, it was also found that the Ag phase often and Ag4Sn phase at the same detection peak.…”

Section: Analysis Of Intermetallic Phases and Its Composition Solderi...mentioning

confidence: 71%

“…The EDX line-scan for Cu and Sn-base solder across the interface (The direction and position of line scanning are shown by the arrows in the figure) were also prove that there are two elements, Sn and Cu, at the Sn/Cu interface, while Sn-Ag/Cu interface has three elements (Sn, Ag, and Cu) in Figure 4. The Ag peak of the XRD pattern (Figure 3) also directly proves the existence of Ag particles (namely, Ag atom [18,19]). The presence of Ag nanoparticles will facilitate the formation of Cu-Sn bonds, leading to a faster increase in the thickness of the Cu 6 Sn 5 layer at the Sn-Ag/Cu soldering interface than that at Sn/Cu, as shown in Figures 5h,j and 6c.…”

Section: Analysis Of Intermetallic Phases and Its Composition Solderi...mentioning

confidence: 82%

“…It can be simply inferred that the Ag phase basically exists during the heat preservation stage of soldering. As we all know from the Sn-Ag binary phase diagram (Figure 2) [17,[20][21][22], when the soldering temperature decreases, the activity of the Ag phase and its saturation and diffusion properties in the molten Sn medium continue to decrease, leading to the continuous precipitation of Ag atoms to form metastable (Ag 4 Sn [18]) or stable (Ag 3 Sn [2,23]) Ag containing compounds. In the cooling stage, the cooling rate of the solder joint is first fast and then slow, resulting in a high degree of undercooling in the early stage [2].…”

Section: Analysis Of Intermetallic Phases and Its Composition Solderi...mentioning

confidence: 99%

See 2 more Smart Citations

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Guo

Kunwar

et al. 2023

Metals

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Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu6Sn5 intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 °C and time duration of 1.5 h. The IMC in Sn-Ag solder was characterized by the formation of grooves during the interfacial reaction, and this can be attributed to the Ag content. Kinetically, the growth rate constants for the height of Cu6Sn5 were observed to increase with temperatures and the presence of Ag in solder. As compared to pure Sn solders, the Sn-3.5Ag solders were observed with interfacial IMC of greater height, smaller base width, and lowered aspect ratio.

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Section: Analysis Of Intermetallic Phases and Its Composition Solderi...mentioning

confidence: 71%

Section: Analysis Of Intermetallic Phases and Its Composition Solderi...mentioning

confidence: 82%

Section: Analysis Of Intermetallic Phases and Its Composition Solderi...mentioning

confidence: 99%

See 1 more Smart Citation

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Guo

Kunwar

et al. 2023

Metals

View full text Add to dashboard Cite

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“…A positive corrosion potential (Ecorr) represents a lower thermodynamic corrosion trend, and a smaller corrosion current density (Jcorr) represents a lower corrosion kinetic rate. Therefore, the more positive the corrosion potential and the smaller the corrosion current density, the better the corrosion-inhibition performance of the coating [36]. Compared with Q235 carbon steel, the modified surface with PDA coating has lower corrosion current density and higher corrosion potential.…”

Section: Anti-corrosion Performancementioning

confidence: 99%

“…Therefore, the more positive the corrosion potential and the smaller the corrosion current density, the better the corrosion-inhibition performance of the coating [36]. Compared with Q235 carbon steel, the modified surface with PDA coating has lower corrosion current density and higher corrosion potential.…”

Section: Anti-corrosion Performancementioning

confidence: 99%

Study on Anti-Scale and Anti-Corrosion of Polydopamine Coating on Metal Surface

Wang

et al. 2023

Coatings

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Some surface coatings can protect metal surfaces and reduce scale deposition. Based on that, the biomimetic material polydopamine (PDA) can form a stable coating on many material surfaces; therefore, we propose an efficient one-step electroplating method for preparing anti-scale PDA coatings with high stability. The scale deposition test showed that the deposition weight of calcium carbonate on the coating is less than that of carbon steel after immersing in a supersaturated solution of calcium carbonate for 12 h at 70 °C and 90 °C, with a coating scale-inhibition efficiency of 55.02% and 66.96%, respectively. By using molecular dynamics simulation, it was found that water adsorption layers exist near the metal’s surface, and the existence of water adsorption layers on the hydrophilic surface is the main reason for the initial deposition of calcium carbonate. The interaction energy between the PDA molecular layer and water is weaker (−5.69 eV) for the surface with the PDA coating, and there is no dense water adsorption layer on the coating, which leads to the low probability of calcium carbonate adsorption on the PDA coating surface. Therefore, PDA coating can inhibit the deposition of calcium carbonate on the surface.

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Tin Silver Alloy as a Biomaterial: Corrosion Characteristics and Cellular Behavior

Goodwin,

Mace,

Gilbert

2024

J Biomedical Materials Res

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Tin‐silver (Sn‐Ag) has been used as a permanently implanted biomaterial within the Essure female sterilization device and in dental amalgams; however, little data exist for Sn‐Ag's corrosion characteristics and/or cellular interactions. In this study, to assess its suitability as a degradable metallic biomaterial, 95–5 wt% Sn‐Ag solder was subjected to corrosion testing including open circuit potential (OCP), electrochemical impedance spectroscopy (EIS), and anodic potentiodynamic polarization in phosphate‐buffered saline (PBS) and cell culture media (with serum proteins) at room temperature (25°C) and body temperature (37°C). Cell culture studies were also performed. Mouse pre‐osteoblast cells (MC3T3‐E1) were cultured in media on Sn‐Ag discs and monitored over 24 h at potentials below, around, or above Sn‐Ag's breakdown potential, fixed, and then viewed using SEM. Separately, cells on tissue culture plastic were subjected to increasing concentrations of SnCl2 in media for 24 h before a live‐dead imaging at each concentration to determine cell viability and area fraction covered when compared with a control well. The results show both passive (in PBS), with a breakdown potential of −250 mV versus Ag/AgCl and active polarization behavior (in AMEM with proteins). EIS results showed polarization resistance (Rp) in the 105 Ωcm2 range but decreased generally with increasing temperature (p < 0.05). Cells were well attached on Sn‐Ag surfaces at OCP and below the breakdown potential, but when anodically polarized, cells reduced their spread area and became more spherical, indicating less viability. SnCl2 exhibited a dose‐dependent killing effect on MC3T3 cells with a lethal dose for 50% of about 0.5 mM. The results of these experiments show that Sn‐Ag alloys can be considered as degradable metallic biomaterials.

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Selective corrosion of β-Sn and intermetallic compounds in an Ag–Sn alloy at different potentials in NaCl and Na2SO4 solutions

Cited by 8 publications

References 51 publications

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

Study on Anti-Scale and Anti-Corrosion of Polydopamine Coating on Metal Surface

Tin Silver Alloy as a Biomaterial: Corrosion Characteristics and Cellular Behavior

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