Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

Ryspayeva, Assel; Jones, Thomas D. A.; Esfahani, Mohammadreza Nekouie; Shuttleworth, Matthew P.; Harris, Russell A.; Kay, Robert W.; Desmulliez, Marc Phillipe Yves; Marqués-Hueso, José

doi:10.1109/ted.2019.2897258

Cited by 19 publications

(15 citation statements)

References 29 publications

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“…The Ag + ions embedded into the resin matrix serve as seeding sites for the adsorption of copper ions during the immersion of these samples into the electroless copper bath. [ 55 ] Meanwhile, the Pd + ions that are bound on the surface of the photopolymer act as catalytic sites for copper ion adsorption during the plating stage. Dispersing silver salt in the resin changes its optical properties from clear to slightly opaque, influencing its transmittance properties.…”

Section: Resultsmentioning

confidence: 99%

Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallization

et al. 2022

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Herein, a 3D printing technique to enable the manufacturing of selectively plated polymer objects by photopolymer printing and copper metallization is presented. Metallized plastic has become popular in a number of industries due to its lightweight, flexibility of design, and cost‐effective fabrication. Common metallization techniques require multiple pretreatment steps, such as surface etching, sensitization/activation, and acceleration. The proposed method, by eliminating the sensitization step, allows selective metallization of 3D‐printed samples by direct plating. The method relies on the inclusion of silver seeds into a mixture of acrylate‐ and methacrylate‐based monomers and oligomers, which enables direct electroless copper metallization following 3D printing. Ag(I) ions act as catalytic sites for copper deposition. Copper films grown with embedded 2 and 4 wt% Ag(I) seeds reach thicknesses of 5.7 ± 1.2 and 7.7 ± 1.3 μm, respectively. Furthermore, printing with pristine and silver‐modified resins on the same sample allows selective plating: only the modified resin is plated leaving the pristine resin unaffected. A proof‐of‐concept temperature sensor is manufactured to demonstrate the performance of the printed interconnects.

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Section: Resultsmentioning

confidence: 99%

Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallization

et al. 2022

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“…Selective irradiation leads to the localized photochemical reaction according to the designed pattern. There are several types of lithography methods such as photolithography (Figure F), − stereolithography (Figure G), − and laser cutting (Figure H). − …”

Section: Stretchable Conductive Nanocompositesmentioning

confidence: 99%

Soft Bioelectronics Based on Nanomaterials

et al. 2021

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Recent advances in nanostructured materials and unconventional device designs have transformed the bioelectronics from a rigid and bulky form into a soft and ultrathin form and brought enormous advantages to the bioelectronics. For example, mechanical deformability of the soft bioelectronics and thus its conformal contact onto soft curved organs such as brain, heart, and skin have allowed researchers to measure high-quality biosignals, deliver real-time feedback treatments, and lower long-term side-effects in vivo. Here, we review various materials, fabrication methods, and device strategies for flexible and stretchable electronics, especially focusing on soft biointegrated electronics using nanomaterials and their composites. First, we summarize top-down material processing and bottom-up synthesis methods of various nanomaterials. Next, we discuss state-of-the-art technologies for intrinsically stretchable nanocomposites composed of nanostructured materials incorporated in elastomers or hydrogels. We also briefly discuss unconventional device design strategies for soft bioelectronics. Then individual device components for soft bioelectronics, such as biosensing, data storage, display, therapeutic stimulation, and power supply devices, are introduced. Afterward, representative application examples of the soft bioelectronics are described. A brief summary with a discussion on remaining challenges concludes the review.

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“…Selective electroless Cu plating was performed on the Ag photoreduced surfaces using the process outlined in a previous publication [29]. This formulation allows selective plating only on the areas that present metallic seeds [30,31]. IL immersion Ag plating was then performed on the selective electroless Cu plated surface.…”

Section: Introductionmentioning

confidence: 99%

Spinach-based photo-catalyst for selective plating on polyimide-based substrates for micro-patterning circuitry

Marqués-Hueso

Jones

Watson

et al. 2020

Chemical Engineering Research and Design

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This is a PDF file of an article that has undergone enhancements after acceptance, such as the addition of a cover page and metadata, and formatting for readability, but it is not yet the definitive version of record. This version will undergo additional copyediting, typesetting and review before it is published in its final form, but we are providing this version to give early visibility of the article. Please note that, during the production process, errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.

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Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

Abstract: This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination.

Cited by 19 publications

References 29 publications

Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallization

Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallization

Soft Bioelectronics Based on Nanomaterials

Spinach-based photo-catalyst for selective plating on polyimide-based substrates for micro-patterning circuitry

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