Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic field

Danilova, Sofya; Graves, John; Cobley, Andrew

doi:10.1016/j.matlet.2018.02.062

Cited by 3 publications

(4 citation statements)

References 13 publications

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“…The catalyst did not have any adhesion to the substrate, which resulted in poor adhesion of deposited copper. In our previous work [24] , that effect was not observed due to the use of a lower concentration of catalyst in the dispersion, which resulted in less catalyst deposited at the centre of the pattern (case 1).…”

Section: Deposition With Single Magnetmentioning

confidence: 83%

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Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)

Danilova

Graves

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et al. 2021

Electrochimica Acta

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Section: Deposition With Single Magnetmentioning

confidence: 83%

“…Instead of an expensive precious metal palladium catalyst, a magnetic magnetite-silver composite catalyst was used. Although the SMMF method is at an early stage of development, previous work by our group has demonstrated the ability to achieve a selective pattern of parallel lines by using a magnet [24][25][26] .…”

Section: Introductionmentioning

confidence: 99%

Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)

Danilova

Graves

Sort

et al. 2021

Electrochimica Acta

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“…The preparation of the conductive circuits is one of the most important steps in printed electronics industry, such as PCBs, FPCs, RFID tags, sensors, printed batteries, etc., where low circuit resistance, large area, high production efficiency, and low cost are needed. − Subtractive process is the traditional way to prepare conductive circuits in which the metal-clad substrate is first masked by photoresist via photolithography followed by etching the exposed metal to keep the designed conductive patterns . Obviously, the subtractive process is wasteful in material, harmful to the environment, and limited in line width and substrates . Large amounts of liquid waste loaded with toxic heavy metal ions and organics were produced in etching and photolithography steps, causing environmental disaster if discharged directly.…”

Section: Introductionmentioning

confidence: 99%

“…4 Obviously, the subtractive process is wasteful in material, harmful to the environment, and limited in line width and substrates. 5 Large amounts of liquid waste loaded with toxic heavy metal ions and organics were produced in etching and photolithography steps, causing environmental disaster if discharged directly. Moreover, the undercut of the conductive circuits occurred during wet etching is inevitable, resulting in the low yield of producing ultrafine circuits (lower than 35 μm 6−8 ), limiting the further miniaturization of the electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Additive Preparation of Conductive Circuit Based on Template Transfer Process Using a Reusable Photoresist

Zhu

Tang

Jin

et al. 2020

ACS Appl. Mater. Interfaces

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To solve the problems of a conventional subtractive process for preparing conductive circuits, numerous alternative additive processes have been investigated, such as screen or inkjet printing, selective electroless plating, laser-induced forward transfer, etc. They all lead to a simpler procedure, less pollution, and finer line width but are still faced with difficulties like low conductivity and thickness, poor adhesion, and high cost. PDMS is a kind of material with low surface energy, leading to low adhesion with adhesive. Under these circumstances, a simple template transfer process for additively preparing conductive circuits is reported. The process to form the template includes the preparation of a photolithographic mask on the carrier copper foil and adsorption of PDMS anti-adhesion coating. Followed by metal deposition through electroplating on the template, the conductive circuits are transferred to the target substrate. Thus, the designed conductive circuits on various substrates including paper and cloth are formed. The template can be used again after being reimmersed into PDMS anti-adhesion coating. The components and the concentration of the coating are carefully discussed, and the mechanism of anti-adhesion is also researched by EIS and XPS. The copper circuits show a line width of 10 μm, a peeling strength of 7.11 N/cm, and a resistivity of 1.93 μΩ·cm, which is similar to that of bulk copper. With low pollution and cost, high versatility, and good electrical and adhesion performance, the template transfer process shows a good application prospect in the large-scale production of flexible electronics like sensors, RFID tags, etc.

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Experimental Studies of Microwave Tubes with Components of Electron–Optical and Electrodynamic Systems Implemented Using Novel 3D Additive Technology

et al. 2022

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Novel additive technology of the Chemical Metallization of Photopolymer-based Structures (CMPS) is under active elaboration currently at the IAP RAS (Nizhny Novgorod). The use of this technology has made it possible to implement components of electron–optical and electrodynamic systems for high-power microwave vacuum tubes, such as a gyrotron and a relativistic Cherenkov maser, the design and experimental studies of which are described in this paper. Within the framework of the gyrotron developments, we carried out a simulation of the distribution of the heat load on the collector of high-power technological gyrotron taking into account secondary emission. The prospect of a significant reduction in the maximum power density of the deposited electron beam was shown. The experimental study of the gyrotron collector module manufactured using CMPS technology demonstrated high potential for its further implementation. Recent results of theoretical and experimental studies of a spatially extended Ka-band Cherenkov maser are presented. In this oscillator, the 2D-periodical slow-wave structure made by the proposed technology was applied and a narrow-band generation regime was observed with a sub-GW power level. The design and simulations of a novel selective electrodynamic system for a high-harmonic gyrotron with the planned application of the CMPS technology are discussed.

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Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic field

Cited by 3 publications

References 13 publications

Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)

Electroless copper plating obtained by Selective Metallisation using a Magnetic Field (SMMF)

Additive Preparation of Conductive Circuit Based on Template Transfer Process Using a Reusable Photoresist

Experimental Studies of Microwave Tubes with Components of Electron–Optical and Electrodynamic Systems Implemented Using Novel 3D Additive Technology

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