Selective metallization on additive manufactured polymer for fabrication of integrated device

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

“…Besides, laser-induced metallization was also proposed to achieve high-resolution conductive patterns on the 3D-printed polymers from Pd-embedded polymers. 16,17 Nevertheless, Pd is a rare and expensive catalyst material, 18 which can limit the cost-effective and large-scale utilization of these techniques. As an alternative to the Pd seeding, some studies employed conductive pastes (e.g., silver (Ag) paste) followed by electroless deposition (ED) to create structural polymer electronics with high electrical conductivity (42.6 × 10 6 S m −1 ).…”

“…To address the poor conductivity of the conductive thermoplastic filaments, catalyst-embedded filaments were proposed for 3D-printed parts followed by electroless or electrodeposition. − This approach enabled area-selective metallization and led to a significant improvement in electrical conductivity (i.e., 44.4 × 10 6 S m –1 ) as compared to the bare carbon black filaments. Besides, laser-induced metallization was also proposed to achieve high-resolution conductive patterns on the 3D-printed polymers from Pd-embedded polymers. , Nevertheless, Pd is a rare and expensive catalyst material, which can limit the cost-effective and large-scale utilization of these techniques. As an alternative to the Pd seeding, some studies employed conductive pastes (e.g., silver (Ag) paste) followed by electroless deposition (ED) to create structural polymer electronics with high electrical conductivity (42.6 × 10 6 S m –1 ) .…”

Manufacture of complex pattern flexible copper microcircuits based on silver seeds through chemical growth welding

“…[9][10][11][12] Therefore, the electroless plating at near room temperature shows unusual potential. [13][14][15][16][17][18][19][20][21][22][23] The chemical copper plating process generally involves three steps: the modification of flexible substrates, the reduction of catalytic seeds, and the growth of copper microcircuits. 16,18,[24][25][26] Chen et al 27 modified polyimide (PI) films using a strong alkaline solution, and subsequently printed Cu(II) ink and reductive ink respectively to form copper nanoparticle catalytic patterns.…”

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

“…Established approaches, such as pulsed laser deposition (PLD) and laser chemical vapor deposition (LCVD), may be useful for fabricating materials with unique properties, despite the low processing speeds compared to other laser methods, and the implementation of toxic and expensive precursors [ 14 ]. The two-stage method of selective surface activation, followed by metallization, seems to be promising for industrial use [ 15 , 16 ]; although, currently, it is only available for the deposition of copper patterns and films.…”