2001
DOI: 10.1063/1.1416137
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Selective photoetching and transmission electron microscopy studies of defects in heteroepitaxial GaN

Abstract: Photoelectrochemical (PEC) etching has been used to study defects in heteroepitaxial GaN layers. In Ga-polar layers PEC etching reveals only dislocations in the form of filamentary etch features (whiskers). Transmission electron microscopy (TEM) confirmed a one-to-one correspondence between the whiskers and straight threading dislocations, which are mainly of edge and mixed type. In N-polar layers, apart from dislocations, inversion domains (IDs) also give rise to the formation of more complex etch features th… Show more

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Cited by 54 publications
(32 citation statements)
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“…Photo-etching of the exact oriented sample (Fig. 5a) reveals the dislocations in the form of whiskers, the density (2.5 × 10 9 cm -2 ) of which is a direct measure of the density of dislocations in the GaN epitaxial layers as was demonstrated by calibration of the etch features with cross-sectiona [19,21] and plan-view [22] transmission electron microscopy. However, the GaN layer deposited on the 8° off-orientated substrate shows elongated features instead of whiskers ( Fig.…”
Section: Defect Distributionmentioning
confidence: 99%
“…Photo-etching of the exact oriented sample (Fig. 5a) reveals the dislocations in the form of whiskers, the density (2.5 × 10 9 cm -2 ) of which is a direct measure of the density of dislocations in the GaN epitaxial layers as was demonstrated by calibration of the etch features with cross-sectiona [19,21] and plan-view [22] transmission electron microscopy. However, the GaN layer deposited on the 8° off-orientated substrate shows elongated features instead of whiskers ( Fig.…”
Section: Defect Distributionmentioning
confidence: 99%
“…Two approaches are usually employed for this purpose, namely (i) comparison of dislocation density established by TEM with the density of etch pits (etch features), e.g. [9] and (ii) examination of thin foils prepared from the etched samples using either conventional cross-section specimens [6,10] or focus ion beam (FIB) [12]. For calibration of the orthodox etching method, which reveals dislocations in the form of pits, the latter approach is the most favorable because it yields a direct association of the etch feature with the underlying defect.…”
Section: Introductionmentioning
confidence: 99%
“…: direct calibration by X-ray topography [1] (suitable for dislocation density below 10 5 cm -2 ), comparison with cathodoluminescence (CL) [2], electron beam induced current (EBIC) [3] or another calibrated etching method [4], sequent etching [5] and calibration by TEM, as in e.g. [4][5][6][7][8]. Among these methods the latter is the most attractive because it offers the possibility of establishing not only the one-to-one correspondence between the etch features and the individual defects but also to establish a correlation between different features and their causative defects.…”
Section: Introductionmentioning
confidence: 99%
“…1 However, regions of enhanced emission have also been observed by cross-sectional CL and attributed to decorated dislocations. 2 Previous investigations [3][4][5] indicate that threading dislocations in n-GaN can be visualized by the formation of whiskers during photoelectrochemical ͑PEC͒ etching. The high resistance of whiskers to PEC attack was attributed to the negative charge inherent to threading dislocations in n-GaN.…”
mentioning
confidence: 99%