Selective surface texturing using femtosecond pulsed laser induced forward transfer

Tan, Bo; Venkatakrishnan, Krishnan; Tok, K.G

doi:10.1016/s0169-4332(03)00006-0

Cited by 54 publications

(27 citation statements)

References 14 publications

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“…A clear disadvantage however is that it is not possible to manufacture pitches / line spacings below roughly 150 µm. Several novel technologies are and have been under development worldwide to manufacture low cost fine pitch electronic circuitry [3][4][5][6][7][8][9]. At the Holst Centre, a technology called 'embedded circuitry' has been developed [2].…”

Section: Introductionmentioning

confidence: 99%

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Brand

Kusters

Heeren

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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All-printed, cost effective, smart electronic products are expected to be used in a wide range of applications and in large quantities in our society. The substrate material for these applications will be low cost materials like PEN or PET foils. For the functionality of the printed electronics product it often will still be required to integrate a Si chip. To keep the flexibility of the package and not to add too much to the thickness, the chip needs to be integrated into the product as a bare, thinned die. Because of the low temperature stability of the PEN and PET and the use of printed conductors it is necessary to interconnect the chip using an adhesive. The current paper specifically addresses the challenges associated with this. Research efforts will be discussed on the flip chip bonding of ultrathin (i.e. thickness 20 µm) bare chips on printed circuitry on both PEN and PET foils using a typical anisotropic conductive adhesive (ACA). Based on the results it can be concluded that a reproducible, low contact resistance and a good lifetime and flexural durability can be achieved over a wide range of bonding forces and temperatures. IntroductionRecently a new class of flexible electronics is starting to emerge which is most effectively termed 'printed electronics'. This term often refers to all-printed, cost effective, smart electronic products that will find a wide range of applications in large quantities in our society. Examples include cheap sensor packages attached to food packaging to measure the ripeness of food, smart bandages that monitor the healing of wounds and smart active or passive RFID tags. These cost effective packages can include all-printed functional structures like conductive circuitry, OLED pixels, photodiodes and logics based on organic materials.The substrate material will in most cases not be polyimide as commonly used in the more traditional flexible electronics. By using polyesters like PEN (polyethylene naphtalate) or PET (polyethylene teraphtalate), the substrate costs can be reduced by a factor of 5-10 [1]. A disadvantage of polyesters is however that they are considerably less thermally stable. PEN has a glass transition temperature (T g ) of ~130o C and PET of ~85 o C while poly(imide) has a T g of ~350 o C) [1]. This limitation in thermal stability excludes many well established processes for making electronic products and/or renders the use of existing processes much more challenging.A tangible example of such a printed electronics product is the disposable smart pill blister that is under development at the Holst Centre and its industrial partners. A photograph of a first prototype of it is shown

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Section: Introductionmentioning

confidence: 99%

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Brand

Kusters

Heeren

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

View full text Add to dashboard Cite

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“…Many of these accomplishments have been facilitated by the equally significant developments in laser technology, where improvements in pulse stability and reliability represent the current hallmarks and the controlled delivery of a prescribed photon flux corresponds to a capability on the near horizon [16]. Prior experiments have demonstrated that a diverse set of material transformations can be realized by a judicious choice of the common laser process parameters, such as the laser wavelength, pulse amplitude, temporal and spatial characteristics, polarization, and total photon exposure dose [17][18][19][20][21][22][23][24][25][26][27][28]. The process control system must enable the precise delivery of photons to a specific material with high spatial and temporal resolution; i.e., the laser control system parameters must be appropriately varied for the particular material under irradiation at the optimum time.…”

Section: Introductionmentioning

confidence: 99%

Laser Processing Architecture for Improved Material Processing

Livingston

Helvajian²

2010

Laser Processing of Materials

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This chapter presents a novel architecture and software-hardware design system for materials processing techniques that are widely applicable to laser directwrite patterning tools. This new laser material processing approach has been crafted by association with the genome and genotype concepts, where predetermined and prescribed laser pulse scripts are synchronously linked with the tool path geometry, and each concatenated pulse sequence is intended to induce a specific material transformation event and thereby express a particular material attribute. While the experimental approach depends on the delivery of discrete amplitude modulated laser pulses to each focused volume element with high fidelity, the architecture is highly versatile and capable of more advanced functionality. The capabilities of this novel architecture fall short of the coherent spatial control techniques that are now emerging, but can be readily applied to fundamental investigations of complex laser-material interaction phenomena, and easily integrated into commercial and industrial laser material processing applications. Section 9.1 provides a brief overview of laser-based machining and materials processing, with particular emphasis on the advantages of controlling energy deposition in light-matter interactions to subtly affect a material's thermodynamic properties. This section also includes a brief discussion of conventional approaches to photon modulation and process control. Section 9.2 comprehensively describes the development and capabilities of our novel laser genotype pulse modulation technique that facilitates the controlled and precise delivery of photons to a host material during direct-write patterning. This section also reviews the experimental design setup and synchronized photon control scheme, along with performance tests and diagnostic results. Section 9.3 discusses selected applications of the new laser genotype processing technique, including optical property variations and silicate phase fractionation in a commercial photosensitive glass ceramic and pyroelectric phase transitions in a perovskite

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“…The textured surfaces are fabricated using one of two general approaches. One is the topographic deposition of the desired materials on a surface [3]. This is the "build-up" type approach, in which the surface is constructed from a molecular or atomic scale.…”

Section: Introductionmentioning

confidence: 99%

Surface micromachining via solid electrochemical reaction on oxide ion conductors

et al. 2009

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We propose a simple and novel route for the surface microstructuring of tough materials (glassy carbon, SiC, W and Mo) through a solid electrochemical reaction at a microcontact between the oxide ion conductor and target substrate. More specifically, the surface of materials was locally oxidized by an anodic electrochemical reaction with the oxide ion conductor via the microcontact under a dc bias. Since the oxidation products of the targets were gaseous or sublimable, a fine-patterned surface was obtained as a result of the continuous consumption of the oxidation products formed at the microcontact. The success of the proposed method may stimulate such conventional applications of oxide ion conductors.

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Selective surface texturing using femtosecond pulsed laser induced forward transfer

Cited by 54 publications

References 14 publications

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

Laser Processing Architecture for Improved Material Processing

Surface micromachining via solid electrochemical reaction on oxide ion conductors

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