2012
DOI: 10.1007/s00339-012-7206-x
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Selectiveness of laser processing due to energy coupling localization: case of thin film solar cell scribing

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Cited by 16 publications
(11 citation statements)
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“…Table 1 lists the numerical simulation parameters from literature [30,31]. The initial and boundary conditions of the electron and lattice subsystems were considered as follows.…”
Section: Mathematical Modelmentioning
confidence: 99%
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“…Table 1 lists the numerical simulation parameters from literature [30,31]. The initial and boundary conditions of the electron and lattice subsystems were considered as follows.…”
Section: Mathematical Modelmentioning
confidence: 99%
“…Hermann et al [21] applied a theoretical method to compare the fine structural characteristics of P2 and P3 layers that were scribed using nanosecond-and femtosecond-pulsed lasers. Račiukaitis et al [22] also applied a numerical method to verify the selectiveness of picosecond laser processing for ablating complex CIGS thin-film structures with low thermal impact. The simulation results reported by previous studies on damage-free laser processes for fabricating thin-film CIGS solar cells have failed to elucidate the mechanisms or melting problems involved in surface-pattern techniques, even where picosecond and femtosecond lasers are used.…”
Section: Introductionmentioning
confidence: 99%
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“…As a result, industrial processes based on femtosecond and picosecond laser pulse durations are becoming increasingly widespread. Manufacturing applications include the very precise drilling of holes for fuel-injection nozzles [4], the dicing of silicon wafers [5], the scribing of thin film solar cells [6] and the fabrication of volume Bragg gratings in transparent bulk materials [7]. Early ultrashort-pulse laser systems suffered from a comparatively low processing speed which slowed down their uptake in industry [3].…”
Section: Introductionmentioning
confidence: 99%
“…In the case of the third isolating scribe (P3), two main scribing approaches were reported in the literature – ablation of the full layer stack to expose the molybdenum back-contact51011, and the removal of the front-contact only91112. These two methods can be addressed as the laser scribe P3 “type 1” and “type 2”, respectively.…”
mentioning
confidence: 99%