Self-Aligned 3D Chip Integration Technology and Through-Silicon Serial Data Transmission

Sun, Fengda

doi:10.5075/epfl-thesis-5182

2011

DOI: 10.5075/epfl-thesis-5182

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Self-Aligned 3D Chip Integration Technology and Through-Silicon Serial Data Transmission

Fengda Sun¹

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2014

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O<inf>2</inf> plasma treatment in polymer insulation process for through silicon vias

Zhuang

Jiang

Zhang

et al. 2014

2014 15th International Conference on Electronic Packaging Technology

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Through silicon via (TSV) technology has been widely applied in CMOS image sensors (CIS). This paper reports the wetting behavior of polymer liquid in the TSV insulation process by spin coating. The O 2 plasma treatment was used to increase the hydrophilicity of the substrate surface in order to reduce the adhesion between the polymer liquid and the via sidewall. This surface treatment was to ensure that the polymer liquid can enter the vias smoothly. Besides, the O 2 plasma treatment to the wafer could also improve the wetting rate and decrease the balanced contact angle. During the course of the present study, different parameters of power and time of O 2 plasma treatment were used to modify the wafer surface and the sidewall of vias. The optimal O 2 plasma treatment condition was determined with the power of 160 W and the processing time of 25 s. It was confirmed that the method of O 2 plasma treatment is beneficial to the wetting in the deposition process of the polymer insulation layer for TSVs. Keywords-through silicon via; O 2 plasma treatment; polymer liquid; insulation; adhesion 2014 15th International Conference on Electronic Packaging Technology 978-1-4799-4707-2/14/$31.00 ©2014 IEEE

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O<inf>2</inf> plasma treatment in polymer insulation process for through silicon vias

Zhuang

Jiang

Zhang

et al. 2014

2014 15th International Conference on Electronic Packaging Technology

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show abstract

Development of 3D electro-optical integration based on silicon photonic TSV interposer

Yang¹

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Self-Aligned 3D Chip Integration Technology and Through-Silicon Serial Data Transmission

Cited by 2 publications

References 0 publications

O<inf>2</inf> plasma treatment in polymer insulation process for through silicon vias

O<inf>2</inf> plasma treatment in polymer insulation process for through silicon vias

Development of 3D electro-optical integration based on silicon photonic TSV interposer

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