1987
DOI: 10.1049/el:19870261
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Self-aligned Si MESFETs fabricated in thin silicon-on-insulator films

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Cited by 9 publications
(3 citation statements)
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“…The early SOS substrates suffered from reduced electron mobility due to defects at the silicon: sapphire interface. With the introduction of SOI wafers, MESFET channel layers with higher electron mobility became available, leading to enhanced transconductance compared to earlier devices [16,17]. The use of SOI substrates eliminated many of the problems associated with off-state leakage currents allowing for near-ideal sub-threshold performance [18].…”
Section: Silicon Based Mesfetsmentioning
confidence: 99%
“…The early SOS substrates suffered from reduced electron mobility due to defects at the silicon: sapphire interface. With the introduction of SOI wafers, MESFET channel layers with higher electron mobility became available, leading to enhanced transconductance compared to earlier devices [16,17]. The use of SOI substrates eliminated many of the problems associated with off-state leakage currents allowing for near-ideal sub-threshold performance [18].…”
Section: Silicon Based Mesfetsmentioning
confidence: 99%
“…Various groups have reported silicon MESFETs fabricated using either bulk [2], [3] or SOI substrates [3], [4], [5], [6]. These devices were fabricated using CMOS compatible processing steps and used tungsten, aluminum or metal silicides for the Schottky gate.…”
Section: Soi Mesfet Fabricationmentioning
confidence: 99%
“…Other silicon-based MESFETs have been demonstrated using CMOS compatible process steps, but none of them used a standard CMOS process flow [11-14]. The key step in the MESFET fabrication is the use of the self-aligned silicide (salicide) process to form the Schottky gate [8].…”
Section: Introductionmentioning
confidence: 99%