Self-aligning microfluidic interconnects for glass- and plastic-based microfluidic systems

Abstract

In this work, we present novel self-aligning fluidic interconnection techniques with low dead volume and pressure drop for generic microfluidic systems and capillary electrophoresis chips. We have successfully designed, fabricated and characterized two self-aligning fluidic interconnection techniques in this work, both resulting in low dead volume and low pressure drop across the interconnects. The first technique is a serial assembly technique, in which each fluidic interconnect is assembled individually, exhibiting a pressure drop of 977 Pa (0.14 psi) at a flow rate of 100 µl min −1 . The second technique is a parallel assembly technique that is suitable for high-density interconnects with multi-stacked generic microfluidic systems, which has a pressure drop of 1024 Pa (0.15 psi) at a flow rate of 100 µl min −1 . Furthermore, the parallel assembly technique is ideally suited for plastic-based microfluidic systems. We have simulated the flow characteristics of these interconnection schemes and, based in part on the simulation results, we have designed the above interconnection schemes. We have also characterized these interconnects in terms of the physical robustness of the interconnection scheme. The serial interconnection scheme can theoretically withstand 2.6 MPa and the parallel interconnection scheme can withstand a theoretical maximum pressure of 6.6 MPa.

Polymer bonding by induction heating for microfluidic applications

“…Puntambekar and C.H. Ahn designed couplers with cavities in the top layer of a microfluidic system [66]. The system was heated up and tubing with an insert was put into the couplers, melting and filling the cavities.…”

A highly reliable integrated PDMS interconnector with a long cast flange for microfluidic systems

“…Furthermore, this kind of permanent interconnection is time consuming in the alignment and assembly process. In order to overcome the disadvantages of this permanent interconnection, reversible interconnections were developed (Zhen and Maeda 2003;Snakenborg et al 2007;Sabourin et al 2009;Nittis et al 2001;McDonald and Whitesides 2002;Zhen and Maeda 2002;Puntambekar and Ahn 2002;Pattekar and Kothare 2003;Bhagat et al 2007Perozziello et al 2008Yao et al 2000;Peles et al 2004;Lee et al 2004;Chiou and Lee 2004;Pepper et al 2007;Christensen et al 2005;Dalton and Karan 2007).…”

A fluidic interconnection system for polymer-based microfluidic devices

“…Another approach is to dip the tip of a capillary tube in liquid nitrogen to temporarily shrink it and then fit it in cylindrical hole with diameter slightly less than capillary OD at room temperature. Other methods for making capillary connections have also been introduced, such as using polymer sealant and melting the capillary tip into the inlet hole as presented by Tsai et al (2001), Puntambekar et al (2002), Pattekar and Kothare (2003) and Kovacs (1999). Alternatively, it is also possible to use couplers to ease aligning and sealing.…”

“…In another work, Gray et al (1999) reported several micromachined interconnects using a combination of silicon fusion bonding and deep reactive ion etching. Puntambekar and Ahn (2002) fabricated a self-aligned fluidic interconnect with low dead volume and pressure drop (2002). Tsai and Lin (2001) developed a microfluidic interconnect with an integrated Mylar sealant.…”