Self‐assembled layers were formed using the compound of 4‐(2‐aminophenylthio)‐5‐(5‐mercaptopentylthio) phthalo‐nitrile (AMPN) to protect the copper surface from chloride corrosion. Scanning electron microscopy (SEM), atomic force microscopy (AFM) and Fourier transform infrared spectroscopy (FTIR) techniques were used to examine the interaction of self‐assembled layers with the copper surface. Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization and linear polarization resistance methods were used in 3.5% NaCl solution to investigate the effect of self‐assembled layers on copper corrosion. The results show that the optimum waiting time for the layer formed on the copper surface is 8 hours and the AMPN concentration is 15 mM. The AMPN‐self assembled film on the copper surface exhibited a maximum of 98.7% inhibition.