Self-assembly of TaC@Ta core–shell-like nanocomposite film via solid-state dewetting: Toward superior wear and corrosion resistance

Ren, Ping; Wen, Mao; Zhang, Kan; Du, Suxuan; Zhang, Yidan; Chen, Jianhong; Zheng, Weitao

doi:10.1016/j.actamat.2018.08.055

Cited by 44 publications

(24 citation statements)

References 87 publications

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“…It has gained significant research impetus due to its both destructive nature raising concerns over the reliability of thin films [7][8][9][10] and constructive nature that can be utilized for creating micro-and nano-sized patterns that are extremely difficult to produce using standard micro-and nano-fabrication processes [11][12][13][14]. In particular, the features formed by the dewetting of thin metallic films find applications in myriad fields, such as microelectronic devices, photovoltaic cells, sensors, micro-electro-mechanical systems, etc [15][16][17][18][19]. Herein, the features must remain stable during the process integration as well as the regular operation of the system, which may be subjected to thermal cycling, isothermal heating (as during annealing treatment), etc.…”

Section: Introductionmentioning

confidence: 99%

Stability of Cu-islands formed on Si substrate via ‘dewetting’ under subsequent thermal cycling

Sonawane

Kumar

2021

Nanotechnology

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Very thin metallic films deposited on a substrate often dewet upon thermal exposure, forming discrete islands of micrometer and nanometer-sized metal particles. Herein, Cu islands on Si substrate, which were formed due to agglomeration (or ‘dewetting’) of Cu thin film at 600 °C, were exposed to thermal cycling, and the ensuing evolution in their morphology was monitored. Thermal cycling was performed between either −25 °C and 150 °C or 25 °C and 400 °C, using different heating and cooling rates. With faster heating-cooling rates, a change in the shape and size of the Cu islands was observed, whereas a slow heating-cooling rate did not induce noticeable effect on their morphology. Furthermore, the formation of new nano- and micro-sized particles, probably through the dewetting of the ultra-thin layer of Cu that was left intact during the initial agglomeration treatment, was observed during the thermal cycling performed at fast rates up to 400 °C. Finite element analysis, incorporating Anand’s viscoplasticity model, revealed the existence of high strain energy density in the vicinity of the particle-Si interface when the thermal cycling is carried at a faster ramp rate, suggesting the pivotal role of thermal stresses, in addition to the maximum temperature, in controlling the morphology of the Cu particles and the dewetting of the residual ultra-thin layer of Cu on Si.

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Section: Introductionmentioning

confidence: 99%

Stability of Cu-islands formed on Si substrate via ‘dewetting’ under subsequent thermal cycling

Sonawane

Kumar

2021

Nanotechnology

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“…The constructive usage of solid-state dewetting is not limited to the electronics, as it has also been used for processing composites for structural applications. Recently, Ren et al reported that dewetting-induced nano-particularization of TaC inside shells of Ta in a TaC–Ta composite had superior hardness, toughness, wear, and corrosion resistance, as compared to the traditional composite, that is, the composite formed without the dewetting process route. Nevertheless, as a continuous thin film fragments through a dewetting process (void nucleation and growth), this phenomenon is also a major reliability concern in numerous micro- and nanoscale devices and appliances, such as reflectors, microelectronics, sensors, and so forth, that have several components made of very thin metal films. , Based on this short description, it is imperative to study dewetting of thin films.…”

Section: Introductionmentioning

confidence: 99%

New Insights into Dewetting of Cu Thin Films Deposited on Si

2020

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Very thin metallic films are susceptible to dewetting upon thermal excursions, resulting in fragmentation and hence loss of structural integrity. Herein, 15 to 55 nm thick Cu films deposited on a Si substrate were isothermally annealed at 400 to 700 °C inside a scanning electron microscope operating in high-vacuum mode and the ensuing dewetting behavior was studied. The in situ observations revealed that the induction time before the void nucleation varied with film thickness as per a power-law with an exponent of 4, and the activation energy for both the void nucleation and the growth was close to the activation energy for surface diffusion. Hillock formation was observed to be a prerequisite for void nucleation in relatively thicker films. To complement the experimental observations, phasefield simulations incorporating a grain boundary grooving model were performed, which showed excellent agreement with the experimental observations. This validates the surface diffusion-controlled, grain boundary grooving-driven mechanism for void nucleation and dewetting of Cu films deposited on Si.

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“…However, no tissue phase was found in the crystal structure of Ta 3 ZrB 8 solid solution. Another possible source of structural toughening is phase transformation during indentation, which dissipates a large amount of deformation energy and deflects or even stops the crack propagation [ 32 ]. However, the results in Fig.…”

Section: Resultsmentioning

confidence: 99%

Solving Strength–Toughness Dilemma in Superhard Transition-Metal Diborides via a Distinct Chemically Tuned Solid Solution Approach

Liu

Gao

et al. 2023

Research

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Solid solution strengthening enhances hardness of metals by introducing solute atoms to create local distortions in base crystal lattice, which impedes dislocation motion and plastic deformation, leading to increased strength but reduced ductility and toughness. In sharp contrast, superhard materials comprising covalent bonds exhibit high strength but low toughness via a distinct mechanism dictated by brittle bond deformation, showcasing another prominent scenario of classic strength–toughness tradeoff dilemma. Solving this less explored and understood problem presents a formidable challenge that requires a viable strategy of tuning main load-bearing bonds in these strong but brittle materials to achieve concurrent enhancement of the peak stress and related strain range. Here, we demonstrate a chemically tuned solid solution approach that simultaneously enhances hardness and toughness of superhard transition-metal diboride Ta 1− x Zr x B 2 . This striking phenomenon is achieved by introducing solute atom Zr that has lower electronegativity than solvent atom Ta to reduce the charge depletion on the main load-bearing B–B bonds during indentation, leading to prolonged deformation that gives rise to notably higher strain range and the corresponding peak stress. This finding highlights the crucial role of properly matched contrasting relative electronegativity of solute and solvent atoms in creating concurrent strengthening and toughening and opens a promising avenue for rational design of enhanced mechanical properties in a large class of transition-metal borides. This strategy of concurrent strength–toughness optimization via solute-atom-induced chemical tuning of the main load-bearing bonding charge is expected to work in broader classes of materials, such as nitrides and carbides.

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Self-assembly of TaC@Ta core–shell-like nanocomposite film via solid-state dewetting: Toward superior wear and corrosion resistance

Cited by 44 publications

References 87 publications

Stability of Cu-islands formed on Si substrate via ‘dewetting’ under subsequent thermal cycling

Stability of Cu-islands formed on Si substrate via ‘dewetting’ under subsequent thermal cycling

New Insights into Dewetting of Cu Thin Films Deposited on Si

Solving Strength–Toughness Dilemma in Superhard Transition-Metal Diborides via a Distinct Chemically Tuned Solid Solution Approach

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