“…Techniques to fabricate FTEG devices by surface modification include drop-casting, [24,60,63,71,77,84,[105][106][107]109,113,147] dip coating, [74,[130][131][132] spin coating, [79][80][81]148] radio-frequency (RF) magnetron sputtering, [20,149,150] thermal vapour deposition, [19,[151][152][153] screen printing, [18,154] and dispenser printing. [128] Drop-casting is one of the most common techniques due to the easy operation without vacuum or high-temperature conditions.…”