Self-healing of a high temperature cured epoxy using poly(dimethylsiloxane) chemistry

Mangun, Christian L.; Mader, A.; Sottos, Nancy R.; White, Scott R.

doi:10.1016/j.polymer.2010.06.050

Cited by 89 publications

(68 citation statements)

References 9 publications

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“…Because the polycondensation between HOPDMS and PDES is stable at elevated temperatures, PDMS-loaded microcapsules were embedded in high-temperature-cured self-healing epoxy composites [239]. The motivation came from the fact that a high-performance structured composite self-healing system requires extended stability at elevated temperatures (100-200°C).…”

Section: Polycondensationmentioning

confidence: 99%

See 1 more Smart Citation

Self-healing polymeric materials based on microencapsulated healing agents: From design to preparation

Zhu

Rong

Zhang

2015

Progress in Polymer Science

489

235

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Section: Polycondensationmentioning

confidence: 99%

“…The different healing effects in ref. [239] and [240] should originate from the different characterization methods used, with the estimate based on the fracture toughness recovery restoration [239] giving a more severe measure.…”

Section: Polycondensationmentioning

confidence: 99%

Self-healing polymeric materials based on microencapsulated healing agents: From design to preparation

Zhu

Rong

Zhang

2015

Progress in Polymer Science

489

235

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“…Furthermore, Yuan correlated the crack width to the size of capsules mentioning that under limited crack opening damage when smaller capsules diameters were applied, higher healing efficiency was achieved. TDCB groove modification has been adopted further on studies regarding the adhesive strength of encapsulated poly(dimethylsiloxane)(PDMS) [48], and the effect of scandium triflate calalyst on healing evolution [49] respectively.…”

Section: Restricting Separation: Short-groove Tdcb Approachmentioning

confidence: 99%

Quantifying thermoset polymers healing efficiency: A systematic review of mechanical testing

Tsangouri

Aggelis

Hemelrijck

2015

Progress in Polymer Science

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“…Mangun et al [3] reported ca. 52% recovery of fracture toughness with a poly(dimethyl siloxane) healing chemistry in an epoxy matrix postcured at 100 • C for 1 h. However, a higher postcure temperature of 177 • C for 4 h reduced the healing efficiency to 28%.…”

Section: Introductionmentioning

confidence: 99%

Self-healing thermoplastic-toughened epoxy

Jones

Watkins

White

et al. 2015

Polymer

Self Cite

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Microcapsule based self-healing strategies enable repair of matrix cracking and delamination in fiber reinforced composite materials. Most of the encapsulated healing systems reported to date lack stability at high temperatures and limit composite processing to relatively low cure temperatures. In prior literature, successful crack healing has been achieved in high temperature cured composites by incorporation of a thermoplastic phase in the matrix. These systems are not autonomous and require the application of heat to soften the thermoplastic phase and initiate healing. In this work, a thermoplastic resin is blended with a high performance epoxy matrix to simultaneously toughen and act as a healing agent in combination with encapsulated solvents. Self-healing is achieved for a commercial Epon 828 epoxy resin cured with diamino diphenyl sulfone above 150°C. Based on early screening studies, two thermoplastic toughening agents, poly bisphenol A-co-epichlorohydrin and polysulfone, are identified as model thermoplastic/ epoxy systems to study. Each system is evaluated using a tapered double cantilever beam (TDCB) fracture specimen geometry. The effect of cure cycle, thermoplastic loading, thermoplastic type, and capsule loading on both phase separation and healing response is investigated. To achieve in situ healing, microcapsules containing a polymer co-dissolved in a solvent are added to the thermoplastic-epoxy blend. Key parameters for capsule stability, such as capsule core content, shell wall robustness, and maximum cure temperature, are identified. Additionally, the optimized systems from the TDCB study are extended to repair of interfacial damage between the fiber and matrix. The effect on both healing performance and interfacial bond strength due to different fiber sizings and interfacial phase separation is investigated. Since interfacial debond of reinforcing fibers is one of the key failure mechanisms in composite materials, prevention of growth of these flaws could greatly extend the lifetime of the composite. ICSHM2013_________________________________________________________________________________ 95

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Self-healing of a high temperature cured epoxy using poly(dimethylsiloxane) chemistry

Cited by 89 publications

References 9 publications

Self-healing polymeric materials based on microencapsulated healing agents: From design to preparation

Self-healing polymeric materials based on microencapsulated healing agents: From design to preparation

Quantifying thermoset polymers healing efficiency: A systematic review of mechanical testing

Self-healing thermoplastic-toughened epoxy

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