Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder

Li, Haokun; Li, Chongyang; Chen, Peixin; Xi, Rui; Li, Feifei; Ling, Huiqin; Li, Ming

doi:10.1007/s13391-024-00492-1

Electron. Mater. Lett.

2024

DOI: 10.1007/s13391-024-00492-1

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Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder

Haokun Li,

Chongyang Li,

Peixin Chen

et al.

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Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder

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References 37 publications

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