2022
DOI: 10.1016/j.matt.2022.01.004
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Self-packaged high-resolution liquid metal nano-patterns

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Cited by 29 publications
(16 citation statements)
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“…Given this versatility and the potential application of these structures in the diverse fields of optics, sensing, microfluidics, die-printing, etc., , we conduct this study to understand the mechanism of the formation of ripples. Previously studied techniques show novel methods of producing patterns using liquid metals. However, a single-step process for creating patterns in ambient conditions with features ranging from 100 nm to 10 μm is not demonstrated in those studies.…”
Section: Introductionmentioning
confidence: 99%
“…Given this versatility and the potential application of these structures in the diverse fields of optics, sensing, microfluidics, die-printing, etc., , we conduct this study to understand the mechanism of the formation of ripples. Previously studied techniques show novel methods of producing patterns using liquid metals. However, a single-step process for creating patterns in ambient conditions with features ranging from 100 nm to 10 μm is not demonstrated in those studies.…”
Section: Introductionmentioning
confidence: 99%
“…Licong An et al developed a GLM nanopatterning technology based on pulsed laser lithography to generate nano-level GLM patterns. [65] As shown in Figure 3c, The GLM nanoparticle solution is uniformly sprayed on a clean silica substrate and then sintered using a fiber laser. The GLM sintered by laser not only has the characteristics of ultra-high resolution, but also has good resistance to external damage.…”
Section: Sintering Methods Of Glm Particlesmentioning
confidence: 99%
“…29−32 Encapsulated LM cannot directly contact other objects and expose to the environment, limiting their practical use in many important application scenarios such as wearable and implantable electrophysiology monitoring, electrostimulation, and gas and temperature sensing. A few efforts have been devoted to increasing the mechanical reliability of LM circuits by converting its liquid state into a biphasic (solid−liquid) state through heat treatment, 33,34 the use of pulsed laser lithography to obtain self-packaged structures, 35 or in situ deposition of adhesive LM particles by chemical modification. 36,37 thermally sensitive substrates, or the use of expensive equipment.…”
Section: Introductionmentioning
confidence: 99%
“…For the surface patterning, the liquid nature of LM conductors makes them prone to mechanical damage, requiring additional encapsulation steps to protect the delicate LM circuits. Encapsulated LM cannot directly contact other objects and expose to the environment, limiting their practical use in many important application scenarios such as wearable and implantable electrophysiology monitoring, electrostimulation, and gas and temperature sensing. A few efforts have been devoted to increasing the mechanical reliability of LM circuits by converting its liquid state into a biphasic (solid–liquid) state through heat treatment, , the use of pulsed laser lithography to obtain self-packaged structures, or in situ deposition of adhesive LM particles by chemical modification. , However, these strategies have resulted in multistep operation for pretreatment and patterning of LM, being incompatible with thermally sensitive substrates, or the use of expensive equipment. Thus, it is highly needed to develop a simple and versatile way to create robust LM circuits for reliable use.…”
Section: Introductionmentioning
confidence: 99%