Wiley Encyclopedia of Electrical and Electronics Engineering 1999
DOI: 10.1002/047134608x.w6826
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Semiconductor Process Modeling

Abstract: The sections in this article are Physical Models Discrete Models Process Modeling and Simulation Tools State of Technology and Future Trends

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Cited by 5 publications
(3 citation statements)
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“…One of the principal sources of stress ÿelds in microfabrication technology is a mismatch between thermal expansion coe cients of di erent material layers [14], [36].…”
Section: Case Studymentioning
confidence: 99%
“…One of the principal sources of stress ÿelds in microfabrication technology is a mismatch between thermal expansion coe cients of di erent material layers [14], [36].…”
Section: Case Studymentioning
confidence: 99%
“…However, the suggested methodology is not restricted in any way to this particular application. Microfabrication technology is concerned with the design and production of microelectronic and micromechanical components [9]. Having established superiority of the component based preconditioning over the standard ILU(0) preconditioning [10], we now examine the efficiency (in terms of wall clock time and memory requirements) of our methodology when various strategies are employed for the solution of local subproblems.…”
Section: Numerical Examplesmentioning
confidence: 99%
“…Microfabrication technology employs sequences of processes that utilise a variety of structural elements by embedding, butting and overlaying material layers which have widely differing mechanical properties and intrinsic built-in stress distributions [10]. There is an increasing interest in simulating the stress evolution of microfabrication structures.…”
Section: Case Studymentioning
confidence: 99%