Semiconductor Wafer Bonding for Solar Cell Applications: A Review

Abstract

Wafer bonding is a highly effective technique for integrating dissimilar semiconductor materials while suppressing the generation of crystalline defects that commonly occur during heteroepitaxial growth. This method is successfully applied to produce efficient solar cells, making it an important area of research for photovoltaic devices. In this article, a comprehensive review of semiconductor wafer‐bonding technologies is provided, focusing on their applications in solar cells. Beginning with an explanation of the thermodynamics of wafer bonding relative to heteroepitaxy, the functionalities and advantages of semiconductor wafer bonding are discussed. An overview of the history and recent developments in high‐efficiency multijunction solar cells using wafer bonding is also provided. Bonded solar cells made of various semiconductor materials are reviewed and various types of wafer‐bonding methods, including direct bonding and interlayer‐mediated bonding, are described. Additionally, other technologies that utilize wafer bonding, such as flexible cells, thin‐film transfer, and wafer reuse techniques, are covered.

Development of high-performance direct X-ray detector materials: from hybrid halide perovskites to all-inorganic lead-free perovskites

“…229 Former research on how to bond perovskite materials to TFT backplanes is scarce. In addition to the above methods, bonding methods widely used in conventional semiconductors, such as direct wafer bonding 230 and indirect bonding, can also be attempted. Moreover, lead bonding and flip chip technology are also commonly used chip bonding methods and fewer studies are using these techniques in perovskites with unknown suitability.…”