More Than Moore 2009
DOI: 10.1007/978-0-387-75593-9_5
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Sensors and Actuators on CMOS Platforms

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Cited by 2 publications
(3 citation statements)
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“…Biofunctionalized impedance-based biosensors are among the most widely used sensors for the detection of bacteria [ 31 ]. The sensing part of the impedance biosensor consists of a relatively simple and well-studied structure as interdigitated electrodes (IDE) [ 32 ]. They are patterned on a metal thin film, processed on silicone die using CMOS or MEMS processing platform.…”
Section: Biosensor Technologymentioning
confidence: 99%
See 1 more Smart Citation
“…Biofunctionalized impedance-based biosensors are among the most widely used sensors for the detection of bacteria [ 31 ]. The sensing part of the impedance biosensor consists of a relatively simple and well-studied structure as interdigitated electrodes (IDE) [ 32 ]. They are patterned on a metal thin film, processed on silicone die using CMOS or MEMS processing platform.…”
Section: Biosensor Technologymentioning
confidence: 99%
“…In the first group, IDE are fixed and have no any degree of movement. In the second group [ 32 ], one set of the comb electrodes is fixed, whereas a complimentary set of comb electrodes has a certain freedom of movement that is defined and controlled by a spring suspension. The freedom of movement for the other set of comb electrodes extends its application area to sensing of movements, accelerations, inclination and pressure.…”
Section: Biosensor Technologymentioning
confidence: 99%
“…This microdevice distribution (MD) technology combines some of the cost efficiency of pickand-place or device-level assembling with the high level of integration offered by wafer-level techniques. In applications involving large differences in die size, wafer-level integration has a large cost penalty that makes it difficult to compete against the better-established pick-and-place technology or, if the process allows it, monolithic integration [16]. Indeed, a key prerequisite for wafer-level integration is that the chip or device to be transferred and the corresponding receiver die must have the same pitch on their respective wafers.…”
Section: Introductionmentioning
confidence: 99%