Separation of Tin, Silver and Copper from Waste Pb-free Solder Using Hydrochloric Acid Leaching with Hydrogen Peroxide

Kim, Sookyung; Lee, Jae-chun; Lee, Kwang-sek; Yoo, Kyoungkeun; Alorro, Richard Diaz

doi:10.2320/matertrans.m2014289

Cited by 25 publications

(12 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Conventional oxidants have disadvantages such as NO x gas emission due to HNO 3 leaching [33][34][35][36], increase in reagent consumption due to instability of H 2 O 2 [37,38], and requirement of additional separation process due to the use of Fe 3+ [38][39][40]. These drawbacks could increase the capital and environmental costs as mentioned above.…”

Section: Introductionmentioning

confidence: 99%

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Park

Eom

Yoo

et al. 2021

Metals

Self Cite

View full text Add to dashboard Cite

In the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu2+ and O2 is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial Cu2+ concentration, and pulp density were investigated to examine the dissolution behavior of Cu from PCBs in 1 mol/L sulfuric acid. The kinetic studies were performed using the obtained leaching data. The leaching rate of Cu from PCBs was found to be higher on addition of Cu2+ and O2 to the leachant in comparison with the addition of O2 or both Cu2+ and N2 in the leachant. The leaching efficiency of Cu was found to be increased with increasing agitation speed, temperature, O2 flow rate, and initial Cu2+ concentration and decreasing pulp density. The 96% of Cu leaching efficiency was obtained under the following conditions: sulfuric acid concentration, 1 mol/L; temperature, 90 °C; agitation speed, 600 rpm; pulp density, 1%; initial Cu2+ concentration, 10,000 mg/L; and O2 flow rate, 1000 cc/min. The leaching data and analyses indicate that the Cu leaching from PCBs followed the reaction-controlled model satisfactorily and determined that the activation energy was found to be 23.8 kJ/mol. Therefore, these results indicate that the sulfuric acid solution with Cu2+ and O2 as a mild leach medium without strong oxidants such as HNO3, H2O2, and Fe3+ is valid for Cu leaching from PCBs.

show abstract

Section: Introductionmentioning

confidence: 99%

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Park

Eom

Yoo

et al. 2021

Metals

Self Cite

View full text Add to dashboard Cite

show abstract

“…Metallic solder consists of mainly tin alloy combined with lead, copper, bismuth, zinc, indium, antimony and silver 26,28,29) . Kim et al 29) reported that Sn 4+ ions can oxidize tin metal in chloride solution and make two stannous (Sn 2+ ) ions as given in eq.…”

Section: Resultsmentioning

confidence: 99%

Dismantling of Electric and Electronic Components from Waste Printed Circuit Boards by Hydrochloric Acid Leaching with Stannic Ions

2017

Self Cite

View full text Add to dashboard Cite

A dismantling process for separating electric and electronic components (EECs) from printed circuit board (PCB) was developed by using hydrochloric acid (HCl) leaching with stannic ions (Sn 4+ ). The use of HCl solution with Sn 4+ ions dissolves tin (Sn)-alloy solder that holds EECs on bare board, which allows the EECs to be detached from PCB. The feasibility of the new dismantling process was investigated by examining the effects of temperature, initial Sn 4+ concentration and agitation speed on the dismantling of PCB. The effect of agitation speed was negligible and the dismantling-completion time was reduced rapidly with increasing temperature and initial Sn 4+ concentration. The dismantling of PCB was completed within 30 min under the leaching conditions; HCl concentration, 1 mol/L; initial Sn 4+ concentration, 13,000 mg/L; temperature, 90 C; and agitation speed, 300 rpm. Each metal was enriched after dismantling process; e.g. the content of Ag increased from 0.016% in PCB to 3.118% in registor. It was expected that ef cient PCB recycling process could be designed to recover metals from EECs with higher concentrated metals.

show abstract

“…The standard reduction potential of Cu is found to be 0.34 V [5,6], which indicates that Cu metal cannot be oxidized and dissolved by sulfuric acid. Additional oxidants such as Fe 3+ [7,8], O 2 [9], Cl 2 [10] and H 2 O 2 [11] or leaching media such as HNO 3 [12,13], HCl [14][15][16][17], and NH 3 [18,19] have been used to leach Cu metals. The leaching of Sb in sulfuric acid solution has rarely been investigated, and the solubility of Sb 2 O 3 or Sb 2 O 5 , which could be generated from the oxidation of Sb, was found to be low [20].…”

Section: Methodsmentioning

confidence: 99%

Hydrochloric Acid Leaching Behaviors of Copper and Antimony in Speiss Obtained from Top Submerged Lance Furnace

Chae

Yoo

Tabelin

et al. 2020

Metals

Self Cite

View full text Add to dashboard Cite

Copper (Cu) has been recovered from speiss generated from top submerged lance furnace process, but it was reported that the leaching efficiency of Cu in sulfuric acid solution decreased with increasing antimony (Sb) content in the speiss. Scanning electron microscopy (SEM)–energy-dispersive X-ray spectroscopy (EDS) results indicate that Sb exists as CuSb alloy, which would retard the leaching of Cu. Therefore, hydrochloric acid leaching with aeration was performed to investigate the leaching behaviors of copper and antimony. The leaching efficiency of Cu increased with increasing agitation speed, temperature, HCl concentration, and the introduction ratio of O2, but also with decreasing pulp density. The leaching efficiency of Cu increased to more than 99% within 60 min in 1 mol/L HCl solution at 600 rpm and 90 °C with 10 g/L pulp density and 1000 cc/min O2. The leaching efficiency of Sb increased and then decreased in all 1 mol/L HCl leaching tests, and precipitate was observed in the leach solution, which was determined to be SbOCl or Sb2O3 by XRD analyses. However, in 2 mol/L–5 mol/L HCl solutions, the leaching efficiency of Sb increased to more than 95% (about 900 mg/L) and remained, so more than 2 mol/L HCl could stabilize Sb ion in the HCl solution.

show abstract

Separation of Tin, Silver and Copper from Waste Pb-free Solder Using Hydrochloric Acid Leaching with Hydrogen Peroxide

Cited by 25 publications

References 12 publications

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Dismantling of Electric and Electronic Components from Waste Printed Circuit Boards by Hydrochloric Acid Leaching with Stannic Ions

Hydrochloric Acid Leaching Behaviors of Copper and Antimony in Speiss Obtained from Top Submerged Lance Furnace

Contact Info

Product

Resources

About