Modern cluster tools tend to clean the chambers each time a specified number of wafers have been processed. Such cleaning processes are intended to reduce the quality risk due to the residual chemicals within the chambers. When such cleaning processes are introduced, the conventional scheduling methods for cluster tools, such as the swap sequence for dual-armed cluster tools, are no longer effective. Therefore, we examine a cyclic scheduling problem for a dual-armed cluster tool that performs cleaning processes periodically. We first identify sufficient conditions for which the conventional backward and swap sequences give the minimum cycle time. We then develop a systematic way of generating all feasible robot task sequences, for which the cycle times can be computed. However, the number of feasible robot task sequences increases too fast to be enumerated as the cleaning cycle and the number of process steps increase. To address the complexity problem, we propose two heuristic scheduling strategies and compare them with the conventional scheduling methods and the lower bound of each schedule, respectively, to verify their effectiveness experimentally.
IntroductionCluster tools are widely used for most semiconductor fabrication processes, such as lithography, etching, and deposition. Cluster tools consist of several processing modules (PMs), a wafer-handling robot, and loadlocks. They have various architectures depending on the configuration of the PMs and the number of robot arms. Figure 1(a) illustrates a radial cluster tool with four PMs and a dual-armed robot. Each PM has a chamber in which wafers are processed, and PM i indicates the PM corresponding to the i th process step. When a cassette containing identical wafers arrives at the loadlock, the robot unloads a wafer and transports it to the first processing chamber according to its recipe.In a one-unit cyclic schedule, each time the robot completes a predefined sequence, one wafer finishes all processes and returns to the loadlock. For example, when each PM in the tool of Figure 1(a) is filled with a wafer, if the robot unloads a wafer from PM 4 , transports it, and loads it into the loadlock, one wafer completes its processing in the tool. Then, if the robot repeats the same operation to the wafers in PM 3 , PM 2 , PM 1 , and the loadlock in sequence, all PMs again have a new wafer and the robot finishes all tasks in a cycle. When the robot loads or unloads a wafer at a PM, the next robot task should be determined depending on the tool state and the number of available robot arms. For example, if the robot is holding two wafers, it should load one of the two wafers into a PM, and if it has one empty arm, it can unload a wafer as the next task.To improve the quality of the wafers, it is very important to clean the processing chambers periodically because, each time they process wafers, residual chemicals remain on the internal surface of the chamber wall, and the residues can contaminate wafers. Such chamber cleaning is used for all chemical vapour deposi...