Serpentine geometry for enhanced performance of nanometer-thin platinum bolometers

Purkl, F.; English, Timothy S.; Yama, G.; Provine, J.; Samarao, Ashwin K.; Feyh, Ando; Kim, Bongsang; O'Brien, G.J.; Ambacher, O.; Howe, Roger T.; Kenny, Thomas W.

doi:10.1109/transducers.2013.6627067

Cited by 7 publications

(8 citation statements)

References 8 publications

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“…14,15 Plasma-enhanced atomic layer deposition (PEALD) is one such method, quickly becoming an essential tool because of its extreme control over the thickness and composition of thin films that can integrate into CMOS compatible platforms. 16−18 PEALD can also mitigate nonideal nucleation behavior that can arise from high surface energy materials such as Pt, a noble metal used for high aspect ratio via passivation, 18 bolometry, 3 and numerous other applications. 19,20 Although Pt suffers from poor wettability and adhesion to oxides, 21 in situ O 2 plasma during deposition has been shown to enhance chemisorption and oxidation by directly supplying O to the substrate surface.…”

Section: ■ Introductionmentioning

confidence: 99%

Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition

Kwon

Perez

Kim

et al. 2021

ACS Appl. Mater. Interfaces

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Interfaces govern thermal transport in a variety of nanostructured systems such as FinFETs, interconnects, and vias. Thermal boundary resistances, however, critically depend on the choice of materials, nanomanufacturing processes and conditions, and the planarity of interfaces. In this work, we study the interfacial thermal transport between a nonreactive metal (Pt) and a dielectric by engineering two differing bonding characters: (i) the mechanical adhesion/van der Waals bonding offered by the physical vapor deposition (PVD) and (ii) the chemical bonding generated by plasma-enhanced atomic layer deposition (PEALD). We introduce 40-cycle (∼2 nm thick), nearly continuous PEALD Pt films between 98 nm PVD Pt and dielectric materials (8.0 nm TiO 2 /Si and 11.0 nm Al 2 O 3 /Si) treated with either O 2 or O 2 + H 2 plasma to modulate their bonding strengths. By correlating the treatments through thermal transport measurements using time-domain thermoreflectance (TDTR), we find that the thermal boundary resistances are consistently reduced with the same increased treatment complexity that has been demonstrated in the literature to enhance mechanical adhesion. For samples on TiO 2 (Al 2 O 3 ), reductions in thermal resistance are at least 4% (10%) compared to those with no PEALD Pt at all, but could be as large as 34% (42%) given measurement uncertainties that could be improved with thinner nucleation layers. We suspect the O 2 plasma generates stronger covalent bonds to the substrate, while the H 2 plasma strips the PEALD Pt of contaminants such as carbon that gives rise to a less thermally resistive heat conduction pathway.

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Section: ■ Introductionmentioning

confidence: 99%

Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition

Kwon

Perez

Kim

et al. 2021

ACS Appl. Mater. Interfaces

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“…Third, by using plasmaenhanced recipes and seed layers optimized for nucleation, sub-20 nm Pt films can be deposited whose Young's modulus and density are within 15 and 5 percent of bulk values, respectively. These robust mechanical properties allow for freestanding structures with aspect ratios as large as 10,000:1 to be integrated with traditional batch wafer-scale processing [4].…”

Section: Introductionmentioning

confidence: 99%

“…In recent years, we've reported the fabrication of uncooled infrared detectors (bolometers) whose performance benefits from these unique characteristics of atomic layer deposited Pt [4,5]. However, practical questions remain, including, at what lower limit of Pt thickness do these beneficial characteristics begin to degrade?…”

Section: Introductionmentioning

confidence: 99%

Atomic Layer Deposited Platinum as a Sensor Material: Uniformity, 1/F Noise, and Young’s Modulus

English¹,

Purkl²,

Daus³

et al. 2014

2014 Solid-State, Actuators, and Microsystems Workshop Technical Digest

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This paper examines previously unmeasured properties of atomic layer deposited Pt films relevant to sensor design, including wafer-scale uniformity, 1/f noise, Young's modulus, and the dependence of all these parameters on ALD processing. We observe an increase in the 1/f noise Hooge parameter of nearly two orders of magnitude with decreasing thickness, which introduces constraints on the design of ALD Pt sensors with low noise requirements. Additionally, we measure the variation in waferscale electrical uniformity and Young's modulus with thickness, highlighting tradeoffs associated with integrating ALD Pt films into wafer-scale processing to achieve freestanding structures with high yield.

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“…These are essential properties as design constraints push device technologies to ever smaller sizes . ALD‐generated films on traditional microfabrication substrates have recently been applied to N/MEMS applications …”

mentioning

confidence: 99%

“…To suspend flat or specifically curled structures, control over the properties of these active thin films is vital. Motivated by prior work with polysilicon ALD coated trench molds , control of mechanical properties by incorporating a three‐dimensional mold in the sacrificial polyimide layer was demonstrated demonstrates the effect of a trench in structural reinforcement of fixed‐free cantilevers.…”

mentioning

confidence: 99%

Ultra‐thin 3D Nano‐Devices from Atomic Layer Deposition on Polyimide

et al. 2014

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A new nanofabrication process for nano/micro‐devices through the combination of inorganic nanomaterials from atomic layer deposition (ALD) on 3‐dimensional organic polyimide substrates is developed. The first suspended ALD structures with multiple patterned suspended levels on the order of 10 nm are fabricated and results surrounding the mechanical stability of ultra‐thin suspended structures are discussed.

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Serpentine geometry for enhanced performance of nanometer-thin platinum bolometers

Cited by 7 publications

References 8 publications

Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition

Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition

Atomic Layer Deposited Platinum as a Sensor Material: Uniformity, 1/F Noise, and Young’s Modulus

Ultra‐thin 3D Nano‐Devices from Atomic Layer Deposition on Polyimide

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