2008
DOI: 10.1109/tcapt.2008.916791
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Shape Optimization of Micro-Channel Heat Sink for Micro-Electronic Cooling

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Cited by 98 publications
(34 citation statements)
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“…It can be seen that the minimised peak wall temperature decreases with increasing pressure drop because as the velocity increases, the thermal resistance decreases. This non-linear trend is in agreement with already published work in open literature [10,26,31]. This relationship between pressure drop and the optimal peak wall temperature difference suggests that with a higher pressure drop, improved cooling capabilities can be achieved; however, due to the rising cost that is associated with pumping power, a trade-off will be vital in order to achieve the optimal benefit from such systems.…”
Section: Resultssupporting
confidence: 90%
“…It can be seen that the minimised peak wall temperature decreases with increasing pressure drop because as the velocity increases, the thermal resistance decreases. This non-linear trend is in agreement with already published work in open literature [10,26,31]. This relationship between pressure drop and the optimal peak wall temperature difference suggests that with a higher pressure drop, improved cooling capabilities can be achieved; however, due to the rising cost that is associated with pumping power, a trade-off will be vital in order to achieve the optimal benefit from such systems.…”
Section: Resultssupporting
confidence: 90%
“…Husain and Kim [12] also carried out a numerical investigation of 3D fluid flow and heat transfer in a rectangular microchannel using water as a cooling fluid in a silicon substrate.…”
Section: Introductionmentioning
confidence: 99%
“…Manufacturing Restraint: Pin-n manufacturing and size constraint allows for typical aspect ratios in the range of 0.5 and 4 [17,18]. Considering fabrication techniques, inter n spacing is limited to 50 microns [19,20]. …”
Section: Constraintsmentioning
confidence: 99%