Shape‐stabilized phase change material with enhanced thermal conductivity fabricated based on biomimetic polymerization and in situ reduction of Cu ions

Abstract

Summary The thermal conductivity of shape‐stabilized phase change material of polyethylene glycols/porous carbon microspheresdoping withcopper particles (PEG/CARM‐Cu) was enhanced based on the adsorption and in situ reduction of Cu2+ using polydopamine microsphere (PDAM)material as the adsorbent. The synthesis of PDAM has the merits of simplicity and environmental friendliness, and the in situ reduction of Cu2+ through pyrolysis has the advantages of easy operation and cost effectiveness. Copper particles prepared by in situ reduction were tightly fixed on the surface of the support ofporous carbon microsphere (CARM), which avoided the sedimentation of copper particles during the phase change process of PEG/CARM‐Cu. According to the SEM, TEM, XRD, TGA and DSC test results, PEG/CARM‐Cu possessed favorable thermal reliability and stability, and the phase change enthalpy of PEG/CARM‐Cu‐2 could reach 101.50 J/g. Additionally, the thermal conductivity of PEG/CARM‐Cu‐2 (0.497 W/(m·K)) was enhanced by 93.3% compared to that ofpure PEG (0.257 W/(m·K)). Therefore, the PEG/CARM‐Cu developed in this paper possessed great potential for real applications.

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

“…Therefore, the preparation of high thermal conductivity polymer composites has become an urgent problem. 3 , 4 Generally speaking, polymers are mixed with thermally conductive fillers to improve the thermal conductivity of polymer materials, 2 , 5 such as metal filler (Ag, 6 − 8 Cu, 9 − 11 Au 12 ), ceramic filler (MgO, 13 , 14 Al 2 O 3 , 15 − 17 BN, 18 − 20 AlN, 21 , 22 SiC, 20 , 23 , 24 SiO 2 25 − 28 ), and carbon material (carbon fiber, 17 , 29 , 30 carbon black, 31 − 34 graphene, 35 , 36 single-wall/multi-wall, 37 − 40 and graphite 39 , 41 − 43 ). However, ceramic fillers and metal fillers generally have high density, and it is difficult to achieve high thermal conductivity with low filler content.…”

“…Polymer composites are widely used in aerospace, automotive, construction, electronic components, and other fields due to their excellent mechanical properties and corrosion resistance. , However, low thermal conductivity limits their applications; they must be modified to obtain high thermal conductivity. Therefore, the preparation of high thermal conductivity polymer composites has become an urgent problem. , Generally speaking, polymers are mixed with thermally conductive fillers to improve the thermal conductivity of polymer materials, , such as metal filler (Ag, − Cu, − Au), ceramic filler (MgO, , Al 2 O 3 , − BN, − AlN, , SiC, ,, SiO 2 − ), and carbon material (carbon fiber, ,, carbon black, − graphene, , single-wall/multi-wall, − and graphite ,− ). However, ceramic fillers and metal fillers generally have high density, and it is difficult to achieve high thermal conductivity with low filler content.…”

Polyethylene Glycol–Calcium Chloride Phase Change Materials with High Thermal Conductivity and Excellent Shape Stability by Introducing Three-Dimensional Carbon/Carbon Fiber Felt

“…Therefore, it is necessary to improve the thermal conductivity of polymer PCMs to meet the demand of rapid energy storage. At present, the thermal conductivities of PCMs are improved by adding high thermal conductivity fillers such as metal materials (silver particles, copper particles, aluminum particles, silver nanowires, copper nanowires), ceramic materials (boron nitride, aluminum nitride, alumina, copper oxide), carbon materials (graphite, graphene, − carbon nanofibers, carbon nanotubes, carbon black, carbon fibers, MXene), and so on. The main method to obtain high thermal conductivity of PCMs is to make the filler form a high thermal conductivity path in the polymer matrix.…”