Purpose: The purpose of this study was to evaluate the effect of incorporation of different concentrations of hydroxyapatite nanorods into two adhesives of two commercial adhesive systems in order to evaluate the effect on rheological properties, microshear bond strength and degree of conversion. Materials and Methods: One hundred twenty specimens were used in the present study. The specimens were divided into two main groups (n=60) according to the type of commercial adhesive used AdheSE Bond (I) and Tetric-N Bond Universal (II). Then each group was subdivided into 4 subgroups (n=15) according to the concentration of incorporated HAp nanorods 0(control), 0.2, 2, 10wt%HAp nanorods (A, B, C and D, respectively). Each subgroup was further divided into 3 divisions according to the type of test performed (n=5). For rheological properties measurements, a rheometer was used to measure the viscosity and the viscoelastic behavior of the adhesives. For microshear bond strength testing (µSBS), the specimens were tested by using a universal testing machine. The type of failure was determined by using scanning electron microscope. The degree of conversion was measured using Fourier Transform Infrared (FTIR) spectroscopy. The data were analyzed using one-way analysis of variance (ANOVA) and Tukey's post hoc significance difference tests. Differences were considered significant at p≤0.05. Two ways analysis of variance ANOVA test was used to study the statistical significance of the interaction between variables (material and HAp nanorods concentrations). Results: The viscosity of experimental adhesives increased gradually with increasing the concentrations of HAp nanorods. In µSBS test, the AdheSE containing 0.2 and 2wt.% HAp nanorods produced significantly the highest values. Regarding degree of conversion (DC), Tetric-N Bond containing 10wt.% HAp nanorods produced significantly the highest value of DC. Conclusion: Incorporation of HAp nanorods with low concentration (0.2wt %) in AdheSE Bond had a positive impact on the bond strength. However, HAp nanorods as fillers were not suitable to be incorporated in Tetric-N Bond.